Area array packaging handbook /

"Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Details the pros and cons of each technology with varying applications. Examines packaging ramifications of hi...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Gilleo, Ken (Autor)
Autor Corporativo: Prismark Partners LLC
Otros Autores: Lasky, Ronald. C., Morvan, Y., Smith, Lee, Fjelstad, Joseph, Yasumura, Gary, Kim, Young Gon, Randolph, Steve, Sanders, John, Cole, Marie S., Bates, Bill, Chen, Tim, Cotterman, Bruce, Garrett, Dave, Mohanty, Rita, Perry, John, Preveti, Mike, Lee, Jacob, Minogue, Gerard, Hwang, Jennie S., Rae, Alan, Blumel, David, Baldwin, Daniel F., Johnson, R. Wayne, Wood, Paul, Rupprecht, Howard, Ghaffarian, Raza, Lazinsky, C., Belmonte, Joe, Schiebel, Gunter, Apell, Marc, McLenaghan, A. James, Lewis, Brian, Jiang, Nan, Travers, Joseph, Anderson, Steve, Zarrow, Phil
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2002]
Edición:First edition.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Ball grid array technology.
Microelectronic packaging.
Electronics industries.
Electronic packaging.
Integrated circuits industry.
Flip chip technology.
Polymers.
Electronics > Materials.
Hermetic sealing.
Adhesives.
Solder and soldering.
Multichip modules (Microelectronics) > Testing.
Screen process printing.
Software measurement.
Electronic apparatus and appliances > Costs.
Surface mount technology.
Electronic books.
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Foreword
  • Section 1: Packaging Concepts and Design
  • Introduction to Electronic Packaging
  • Electronics Industry Overview
  • Trends/Drivers in the Electronics Manufacturing Industry
  • Area Array Packaging
  • Stacked/3D Packages
  • Compliant IC Packaging
  • Flip Chip Technology
  • Options in High-Density Part Cleaning
  • MEMS Packaging and Assembly Challenges
  • Ceramic Ball and Column Grid Array Overview
  • Section 2: Materials
  • Polymer Packaging Materials: Adhesives, Encapsulants, and Underfills
  • Hermetic Packaging Systems: Adhesive and Getter
  • Area Array Solder Spheres, Pastes, and Fluxes
  • Modern Solder and Solder Paste
  • Lead-Free Systems and Process Implications
  • Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder?
  • Section 3: Equipment and Processes
  • Next-Generation Flip Chip Materials and Processes
  • Flip Chip Assembly and Underfilling
  • BGA and CSP Rework: What is Involved?
  • BGA Assembly Reliability
  • Die Attach and Rework
  • Liquid Encapsulation Equipment and Processes
  • Molding for Area Array Packages
  • Screen Printing and Stenciling
  • Criteria for Placement and Processing of Advanced Packages
  • Ovens in Electronics
  • Process Development, Control, and Organization
  • Section 4: Economics and Productivity
  • Metrics: The Key to Productivity
  • Cost Estimating for Electronic Assembly
  • Section 5: Future
  • The Future of Electronic Packaging
  • The Future of SMT Process Equipment
  • Index.

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