Area array packaging handbook /

"Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Details the pros and cons of each technology with varying applications. Examines packaging ramifications of hi...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Gilleo, Ken (Autor)
Autor Corporativo: Prismark Partners LLC
Otros Autores: Lasky, Ronald. C., Morvan, Y., Smith, Lee, Fjelstad, Joseph, Yasumura, Gary, Kim, Young Gon, Randolph, Steve, Sanders, John, Cole, Marie S., Bates, Bill, Chen, Tim, Cotterman, Bruce, Garrett, Dave, Mohanty, Rita, Perry, John, Preveti, Mike, Lee, Jacob, Minogue, Gerard, Hwang, Jennie S., Rae, Alan, Blumel, David, Baldwin, Daniel F., Johnson, R. Wayne, Wood, Paul, Rupprecht, Howard, Ghaffarian, Raza, Lazinsky, C., Belmonte, Joe, Schiebel, Gunter, Apell, Marc, McLenaghan, A. James, Lewis, Brian, Jiang, Nan, Travers, Joseph, Anderson, Steve, Zarrow, Phil
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2002]
Edición:First edition.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Ball grid array technology.
Microelectronic packaging.
Electronics industries.
Electronic packaging.
Integrated circuits industry.
Flip chip technology.
Polymers.
Electronics > Materials.
Hermetic sealing.
Adhesives.
Solder and soldering.
Multichip modules (Microelectronics) > Testing.
Screen process printing.
Software measurement.
Electronic apparatus and appliances > Costs.
Surface mount technology.
Electronic books.
Acceso en línea:Texto completo

MARC

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010 |z  2001041051 
020 |a 0071449450 
020 |a 0071374930 (print-ISBN) 
020 |a 9780071374934 
035 |a (OCoLC)50306865 
040 |a IN-ChSCO  |b eng  |e rda 
041 0 |a eng 
050 4 |a TK7870.15 
082 0 4 |a 621.381/046  |2 21 
100 1 |a Gilleo, Ken.,  |e author. 
245 1 0 |a Area array packaging handbook /  |c Ken Gilleo. 
250 |a First edition. 
264 1 |a New York, N.Y. :  |b McGraw-Hill Education,  |c [2002] 
264 4 |c ?2002 
300 |a 1 online resource (1000 pages) :  |b illustrations. 
336 |a text  |2 rdacontent 
337 |a computer  |2 rdamedia 
338 |a online resource  |2 rdacarrier 
490 1 |a McGraw-Hill's AccessEngineering 
500 |a Print version c2002. 
504 |a Includes bibliographical references and index. 
505 0 |a Foreword -- Section 1: Packaging Concepts and Design -- Introduction to Electronic Packaging -- Electronics Industry Overview -- Trends/Drivers in the Electronics Manufacturing Industry -- Area Array Packaging -- Stacked/3D Packages -- Compliant IC Packaging -- Flip Chip Technology -- Options in High-Density Part Cleaning -- MEMS Packaging and Assembly Challenges -- Ceramic Ball and Column Grid Array Overview -- Section 2: Materials -- Polymer Packaging Materials: Adhesives, Encapsulants, and Underfills -- Hermetic Packaging Systems: Adhesive and Getter -- Area Array Solder Spheres, Pastes, and Fluxes -- Modern Solder and Solder Paste -- Lead-Free Systems and Process Implications -- Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder? -- Section 3: Equipment and Processes -- Next-Generation Flip Chip Materials and Processes -- Flip Chip Assembly and Underfilling -- BGA and CSP Rework: What is Involved? -- BGA Assembly Reliability -- Die Attach and Rework -- Liquid Encapsulation Equipment and Processes -- Molding for Area Array Packages -- Screen Printing and Stenciling -- Criteria for Placement and Processing of Advanced Packages -- Ovens in Electronics -- Process Development, Control, and Organization -- Section 4: Economics and Productivity -- Metrics: The Key to Productivity -- Cost Estimating for Electronic Assembly -- Section 5: Future -- The Future of Electronic Packaging -- The Future of SMT Process Equipment -- Index. 
520 0 |a "Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Details the pros and cons of each technology with varying applications. Examines packaging ramifications of high density interconnects (HDI)" Annotation *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI). 
530 |a Also available in print edition. 
533 |a Electronic reproduction.  |b New York, N.Y. :  |c McGraw Hill,   |d 2002.  |n Mode of access: World Wide Web.  |n System requirements: Web browser.  |n Access may be restricted to users at subscribing institutions. 
538 |a Mode of access: Internet via World Wide Web. 
545 0 |a Contributor biographical information  |u http://www.loc.gov/catdir/bios/mh041/2001041051.html 
546 |a In English. 
588 |a Description based on cover image and table of contents, viewed on April 18, 2007. 
650 0 |a Ball grid array technology. 
650 0 |a Microelectronic packaging. 
650 0 |a Electronics industries. 
650 0 |a Electronic packaging. 
650 0 |a Integrated circuits industry. 
650 0 |a Flip chip technology. 
650 0 |a Polymers. 
650 0 |a Electronics  |x Materials. 
650 0 |a Hermetic sealing. 
650 0 |a Adhesives. 
650 0 |a Solder and soldering. 
650 0 |a Multichip modules (Microelectronics)  |x Testing. 
650 0 |a Screen process printing. 
650 0 |a Software measurement. 
650 0 |a Electronic apparatus and appliances  |x Costs. 
650 0 |a Surface mount technology. 
655 0 |a Electronic books. 
700 1 |a Lasky, Ronald. C. 
700 1 |a Morvan, Y. 
700 1 |a Smith, Lee. 
700 1 |a Fjelstad, Joseph. 
700 1 |a Yasumura, Gary. 
700 1 |a Kim, Young Gon. 
700 1 |a Randolph, Steve. 
700 1 |a Sanders, John. 
700 1 |a Cole, Marie S. 
700 1 |a Bates, Bill. 
700 1 |a Chen, Tim. 
700 1 |a Cotterman, Bruce. 
700 1 |a Garrett, Dave. 
700 1 |a Mohanty, Rita. 
700 1 |a Perry, John. 
700 1 |a Preveti, Mike. 
700 1 |a Lee, Jacob. 
700 1 |a Minogue, Gerard. 
700 1 |a Hwang, Jennie S. 
700 1 |a Rae, Alan. 
700 1 |a Blumel, David. 
700 1 |a Baldwin, Daniel F. 
700 1 |a Johnson, R. Wayne. 
700 1 |a Wood, Paul. 
700 1 |a Rupprecht, Howard. 
700 1 |a Ghaffarian, Raza. 
700 1 |a Lazinsky, C. 
700 1 |a Belmonte, Joe. 
700 1 |a Schiebel, Gunter. 
700 1 |a Apell, Marc. 
700 1 |a McLenaghan, A. James. 
700 1 |a Lewis, Brian. 
700 1 |a Jiang, Nan. 
700 1 |a Travers, Joseph. 
700 1 |a Anderson, Steve. 
700 1 |a Zarrow, Phil. 
710 2 |a Prismark Partners LLC. 
740 0 2 |a Introduction to electronic packaging. 
740 0 2 |a Electronics industry overview. 
740 0 2 |a Trends/drivers in the electronics manufacturing industry. 
740 0 2 |a Area array packaging. 
740 0 2 |a Stacked/3d packages. 
740 0 2 |a Compliant ic packaging. 
740 0 2 |a Flip chip technology. 
740 0 2 |a Options in high-density part cleaning. 
740 0 2 |a Mems packaging and assembly challenges. 
740 0 2 |a Ceramic ball and column grid array overview. 
740 0 2 |a Polymer packaging materials: adhesives, encapsulants, and underfills. 
740 0 2 |a Hermetic packaging systems: adhesive and getter. 
740 0 2 |a Area array solder spheres, pastes, and fluxes. 
740 0 2 |a Modern solder and solder paste. 
740 0 2 |a Lead-free systems and process implications. 
740 0 2 |a Electrically conductive adhesives for surfacemount and flip chip processes: an alternative to solder? 
740 0 2 |a Next-generation flip chip materials and processing. 
740 0 2 |a Flip chip assembly and underfilling. 
740 0 2 |a BGA and CSP rework: what is involved? 
740 0 2 |a BGA assembly reliability. 
740 0 2 |a Die attach and rework. 
740 0 2 |a Liquid encapsulation equipment and processes. 
740 0 2 |a Molding for area array packages. 
740 0 2 |a Screen printing and stenciling. 
740 0 2 |a Criteria for placement and processing of advanced packages. 
740 0 2 |a Ovens in electronics. 
740 0 2 |a Process development, control, and optimization. 
740 0 2 |a Metrics : the key to productivity. 
740 0 2 |a Cost estimating for electronic assembly. 
740 4 2 |a The future of electronic packaging. 
740 4 2 |a The future of SMT process equipment. 
776 0 |i Print version:   |t Area array packaging handbook.  |b First edition.  |d New York, N.Y. : McGraw-Hill Education, 2002  |w (OCoLC)47136668 
830 0 |a McGraw-Hill's AccessEngineering. 
856 4 0 |u https://accessengineeringlibrary.uam.elogim.com/content/book/9780071374934  |z Texto completo 
997 |a (c)2007 Cassidy Cataloguing Services, Inc. 

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