Area array packaging handbook /

"Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Details the pros and cons of each technology with varying applications. Examines packaging ramifications of hi...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Gilleo, Ken (Autor)
Autor Corporativo: Prismark Partners LLC
Otros Autores: Lasky, Ronald. C., Morvan, Y., Smith, Lee, Fjelstad, Joseph, Yasumura, Gary, Kim, Young Gon, Randolph, Steve, Sanders, John, Cole, Marie S., Bates, Bill, Chen, Tim, Cotterman, Bruce, Garrett, Dave, Mohanty, Rita, Perry, John, Preveti, Mike, Lee, Jacob, Minogue, Gerard, Hwang, Jennie S., Rae, Alan, Blumel, David, Baldwin, Daniel F., Johnson, R. Wayne, Wood, Paul, Rupprecht, Howard, Ghaffarian, Raza, Lazinsky, C., Belmonte, Joe, Schiebel, Gunter, Apell, Marc, McLenaghan, A. James, Lewis, Brian, Jiang, Nan, Travers, Joseph, Anderson, Steve, Zarrow, Phil
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2002]
Edición:First edition.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Ball grid array technology.
Microelectronic packaging.
Electronics industries.
Electronic packaging.
Integrated circuits industry.
Flip chip technology.
Polymers.
Electronics > Materials.
Hermetic sealing.
Adhesives.
Solder and soldering.
Multichip modules (Microelectronics) > Testing.
Screen process printing.
Software measurement.
Electronic apparatus and appliances > Costs.
Surface mount technology.
Electronic books.
Acceso en línea:Texto completo
Descripción
Sumario:"Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Details the pros and cons of each technology with varying applications. Examines packaging ramifications of high density interconnects (HDI)" Annotation *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI).
Notas:Print version c2002.
Descripción Física:1 online resource (1000 pages) : illustrations.
Also available in print edition.
Bibliografía:Includes bibliographical references and index.
ISBN:0071449450
0071374930 (print-ISBN)
9780071374934

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