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Thermal conductivity 33 : thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA /

Detalles Bibliográficos
Clasificación:	Libro Electrónico
Autores Corporativos:	International Thermal Conductivity Conference Logan, Utah, International Thermal Expansion Symposium
Otros Autores:	Ban, Heng (Editor )
Formato:	Electrónico Congresos, conferencias eBook
Idioma:	Inglés
Publicado:	Lancaster, PA : DEStech Publications, 2018.
Temas:	Heat > Conduction > Congresses. Heat > Conduction > Measurement > Methodology > Congresses. Materials > Thermal properties > Congresses. Materials > Thermal properties > Measurement > Methodology > Congresses. Expansion (Heat) > Congresses. Expansion (Heat) > Measurement > Methodology > Congresses. Chaleur > Conduction > Congrès. Matériaux > Propriétés thermiques > Congrès. Dilatation (Thermodynamique) > Congrès.
Acceso en línea:	Texto completo

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