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Modeling, analysis, design, and tests for electronics packaging beyond Moore /
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Duxford, United Kingdom :
Woodhead Publishing, an imprint of Elsevier,
[2020]
|
| Colección: | Woodhead Publishing series in electronic and optical materials.
Series on advanced electronic packaging technology and key materials. |
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 001 | KNOVEL_on1128034384 | ||
| 003 | OCoLC | ||
| 005 | 20231027140348.0 | ||
| 006 | m o d | ||
| 007 | cr |n||||||||| | ||
| 008 | 191120s2020 enk ob 001 0 eng d | ||
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| 082 | 0 | 4 | |a 621.381046 |2 23 |
| 049 | |a UAMI | ||
| 100 | 1 | |a Zhang, Hengyun, |e author. | |
| 245 | 1 | 0 | |a Modeling, analysis, design, and tests for electronics packaging beyond Moore / |c Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao. |
| 264 | 1 | |a Duxford, United Kingdom : |b Woodhead Publishing, an imprint of Elsevier, |c [2020] | |
| 300 | |a 1 online resource | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Woodhead Publishing series in electronic and optical materials | |
| 490 | 1 | |a Series on advanced electronic packaging technology and key materials | |
| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Online resource; title from digital title page (viewed on February 4, 2020). | |
| 590 | |a Knovel |b ACADEMIC - Electronics & Semiconductors | ||
| 650 | 0 | |a Electronic apparatus and appliances |x Packaging. | |
| 650 | 6 | |a Appareils électroniques |x Emballage. | |
| 650 | 7 | |a Electronic apparatus and appliances |x Packaging. |2 fast |0 (OCoLC)fst00906815 | |
| 700 | 1 | |a Che, Faxing, |e author. | |
| 700 | 1 | |a Lin, Tingyu, |e author. | |
| 700 | 1 | |a Zhao, Wensheng, |e author. | |
| 776 | 0 | 8 | |i Print version: |a Zhang, Hengyun. |t Modeling, analysis, design, and tests for electronics packaging beyond Moore |z 0081025327 |z 9780081025321 |w (OCoLC)1071140290 |
| 830 | 0 | |a Woodhead Publishing series in electronic and optical materials. | |
| 830 | 0 | |a Series on advanced electronic packaging technology and key materials. | |
| 856 | 4 | 0 | |u https://appknovel.uam.elogim.com/kn/resources/kpMADTEPM1/toc |z Texto completo |
| 938 | |a Askews and Holts Library Services |b ASKH |n AH33821405 | ||
| 938 | |a YBP Library Services |b YANK |n 300952685 | ||
| 994 | |a 92 |b IZTAP | ||