Biscuit baking technology : processing and engineering manual /
Biscuit Baking Technology, Second Edition, is a reference book for senior managers and staff involved in industrial scale biscuit baking. It covers the biscuit industry process, ingredients, formulations, besides design, manufacture, installation, operation and maintenance of the baking ovens. Writt...
Clasificación: | Libro Electrónico |
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Autor principal: | |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
Amsterdam :
Academic Press : Elsevier Ltd.,
[2016]
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Edición: | Second edition. |
Temas: | |
Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Front Cover; Biscuit Baking Technology; Copyright Page; Contents; Biography; Acknowledgements; Introduction; 1 The Biscuits; 1.1 Crackers; 1.2 Process for Snack Crackers; 1.2.1 Description; 1.2.2 Product Specification; 1.2.3 Formulation; 1.2.4 Critical Ingredients; 1.2.5 Mixing; 1.2.6 Standing Time; 1.2.7 Forming; 1.2.8 Baking; 1.2.9 Baking Band; 1.3 Process for Soda Crackers; 1.3.1 Description; 1.3.2 Product Specification; 1.3.3 Formulation; 1.3.3.1 Sponge; 1.3.3.2 Dough; 1.3.4 Critical Ingredients; 1.3.5 Mixing and Fermentation; 1.3.6 Dough Forming; 1.3.7 Baking; 1.3.8 Alternative Oven Band
- 1.3.9 Oil Spray1.3.10 Cracker Breaking; 1.4 Hard Sweet Biscuits; 1.5 Process for Hard Sweet Biscuits; 1.5.1 Description; 1.5.2 Product Specification; 1.5.3 Formulation; 1.5.4 Critical Ingredients; 1.5.5 Mixing; 1.5.6 Forming; 1.5.7 Baking; 1.5.8 Cooling; 1.6 Short Doughs: Rotary Moulded Biscuits; 1.7 Short Doughs (Moulded Biscuits); 1.8 Process for a Moulded Short Dough Biscuit; 1.8.1 Description; 1.8.2 Product Specification; 1.8.3 Formulation; 1.8.4 Critical Ingredients; 1.8.5 Mixing; 1.8.6 Standing Time; 1.8.7 Rotary Moulding; 1.8.8 Baking; 1.8.9 Cooling; 1.9 Cookies
- 1.10 Process for a Chocolate Chip Cookie1.10.1 Description; 1.10.2 Product Specification; 1.10.3 Formulation; 1.10.4 Mixing; 1.10.5 Forming; 1.10.6 Baking; 1.10.7 Cooling; 1.11 Long Shelf Life Cakes, Snack Cakes; 1.12 Summary; Bibliography; 2 Baking Process; 2.1 From the Dough Piece to the Biscuit; 2.1.1 Biscuit Structure; 2.1.2 Moisture Content; 2.1.3 Colour; 2.2 Ingredients; 2.2.1 Wheat Flour; 2.2.2 Wheat Flours: Typical Specifications; 2.2.2.1 Wheat Gluten; 2.2.2.2 Starch; 2.2.3 Sugar; 2.2.4 Leavening Agents; 2.2.5 Fats; 2.3 Baking: The Development of the Biscuit Structure and Texture
- 2.3.1 Moisture Removal2.3.2 Colour; 2.4 Summary; Bibliography; 3 Biscuit Design and Output; 3.1 Cutter and Moulding Roll Layouts; 3.2 Scrap and Scrap-Less Designs; 3.3 Docker Pins; 3.4 Oven Band Loadings; 3.5 Oven Size and Output; 3.6 Output Calculation; 3.7 Summary; Bibliography; 4 Heat Transfer; 4.1 Radiation; 4.1.1 Wavelength; 4.1.2 Distance; 4.1.3 Effect of Radiation on the Dough Pieces; 4.2 Conduction; 4.2.1 Baking; 4.2.2 Oven Insulation; 4.3 Convection; 4.3.1 Convection Baking; 4.4 Summary; 4.4.1 Radiation; 4.4.2 Conduction; 4.4.3 Convection; Bibliography; 5 Oven Designs
- 5.1 Heat Transfer Methods5.1.1 Radiant Heating; 5.1.1.1 Direct Gas-Fired Ovens; 5.1.1.2 Summary; 5.1.1.3 Electric Ovens; 5.1.1.4 Summary; 5.1.1.5 Indirect Radiant Ovens; 5.1.1.6 Summary; 5.1.2 Conduction Heat Transfer; 5.1.3 Convection Baking; 5.1.3.1 Direct Convection Ovens; 5.1.3.2 Indirect Convection Ovens; 5.1.3.3 Summary; 5.1.3.4 'Re-Circ' Ovens; 5.1.3.5 Summary; 5.2 Hybrid Ovens; 5.2.1 Direct Gas-Fired/Indirect Radiant Ovens; 5.2.2 Direct Gas-Fired/Convection Ovens; 5.2.3 Multisystem Ovens; 5.2.4 Dielectric Baking; 5.2.5 Microwave Baking; Bibliography