Reliability of power electronic converter systems /

This book outlines current research into the scientific modeling, experimentation, and remedial measures for advancing the reliability, availability, system robustness, and maintainability of Power Electronic Converter Systems (PECS) at different levels of complexity.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Chung, Henry Shu-hung (Editor ), Wang, Huai (Professor in energy technology) (Editor ), Blaabjerg, Frede (Editor ), Pecht, Michael (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: London : Institution of Engineering and Technology, ©2016.
Colección:IET power and energy series ; 80.
Temas:
Electric current converters.
Reliability (Engineering)
Fiabilité.
TECHNOLOGY & ENGINEERING > Mechanical.
electronics packaging.
photovoltaic power systems.
power convertors.
reliability.
variable speed drives.
wind turbines.
Acceso en línea:Texto completo
Tabla de Contenidos:
  • 1. Reliability engineering in power electronic converter systems
  • 1.1 Performance factors of power electronic systems
  • 1.2 Reliability engineering in power electronics
  • 1.3 Challenges and opportunities in research on power electronics reliability
  • References
  • 2. Anomaly detection and remaining life prediction for power electronics
  • 2.1 Introduction
  • 2.2 Failure models
  • 2.3 FMMEA to identify failure mechanisms
  • 2.4 Data-driven methods for life prediction
  • 2.5 Summary
  • Acknowledgements
  • References
  • 3. Reliability of DC-link capacitors in power electronic converters
  • 3.1 Capacitors for DC-links in power electronic converters
  • 3.2 Failure mechanisms and lifetime models of capacitors
  • 3.3 Reliability-oriented design for DC links
  • 3.4 Condition monitoring of DC-link capacitors
  • References
  • 4. Reliability of power electronic packaging
  • 4.1 Introduction
  • 4.2 Reliability concepts for power electronic packaging
  • 4.3 Reliability testing for power electronic packaging
  • 4.4 Power semiconductor package or module reliability
  • 4.5 Reliability of high-temperature power electronic modules
  • 4.6 Summary
  • Acknowledgements
  • References
  • 5. Modelling for the lifetime prediction of power semiconductor modules
  • 5.1 Accelerated cycling tests
  • 5.2 Dominant failure mechanisms
  • 5.3 Lifetime modelling
  • 5.4 Physics-based lifetime estimation of solder joints within power semiconductor modules
  • 5.5 Example of physics-based lifetime modelling for solder joints
  • 5.6 Conclusions
  • Acknowledgements
  • References
  • 6. Minimization of DC-link capacitance in power electronic converter systems
  • 6.1 Introduction
  • 6.2 Performance tradeoff
  • 6.3 Passive approach
  • 6.4 Active approach
  • 6.5 Conclusions
  • Acknowledgement
  • References
  • 7. Wind turbine systems
  • 7.1 Introduction.
  • 7.2 Review of main WT power electronic architectures
  • 7.3 Public domain knowledge of power electronic converterreliabilities
  • 7.4 Reliability FMEA for each assembly and comparative prospective reliabilities
  • 7.5 Root causes of failure
  • 7.6 Methods to improve WT converter reliability and availability
  • 7.7 Conclusions
  • 7.8 Recommendations
  • Acknowledgements
  • Terminology
  • Abbreviations
  • Variables
  • References
  • 8. Active thermal control for improved reliability of power electronics systems
  • 8.1 Introduction
  • 8.2 Modulation strategies achieving better thermal loading
  • 8.3 Reactive power control achieving better thermal cycling
  • 8.4 Thermal control strategies utilizing active power
  • 8.5 Conclusions
  • Acknowledgements
  • References
  • 9. Lifetime modeling and prediction of power devices
  • 9.1 Introduction
  • 9.2 Failure mechanisms of power modules
  • 9.3 Lifetime metrology
  • 9.4 Lifetime modeling and design of components
  • 9.5 Summary and conclusions
  • Acknowledgements
  • References
  • 10. Power module lifetime test and state monitoring
  • 10.1 Overview of power cycling methods
  • 10.2 AC current PC
  • 10.3 Wear-out status of PMs
  • 10.4 Voltage evolution in IGBT and diode
  • 10.5 Chip temperature estimation
  • 10.6 Processing of state monitoring data
  • 10.7 Conclusion
  • Acknowledgement
  • References
  • 11. Stochastic hybrid systems models for performance and reliability analysis of power electronic systems
  • 11.1 Introduction
  • 11.2 Fundamentals of SHS
  • 11.3 Application of SHS to PV system economics
  • 11.4 Concluding remarks
  • Acknowledgements
  • References
  • 12. Fault-tolerant adjustable speed drive systems
  • 12.1 Introduction
  • 12.2 Factors affecting ASD reliability
  • 12.3 Fault-tolerant ASD system
  • 12.4 Converter fault isolation stage in fault-tolerant system design.
  • 12.5 Control or hardware reconfiguration stage in fault-tolerant system design
  • 12.6 Conclusion
  • Acknowledgements
  • References
  • 13. Mission profile-oriented reliability design in wind turbine and photovoltaic systems
  • 13.1 Mission profile for renewable energy systems
  • 13.2 Mission-profile-oriented reliability assessment
  • 13.3 Reliability assessment of wind turbine systems
  • 13.4 Reliability assessment of PV system
  • 13.5 Summary
  • Acknowledgements
  • References
  • 14. Reliability of power conversion systems in photovoltaic applications
  • 14.1 Introduction to photovoltaic power systems
  • 14.2 Power conversion reliability in PV applications
  • 14.3 Future reliability concerns
  • Acknowledgements
  • References
  • 15. Reliability of power supplies for computers
  • 15.1 Purpose and requirements
  • 15.2 Thermal profile analysis
  • 15.3 De-rating analysis
  • 15.4 Capacitor life analysis
  • 15.5 Fan life
  • 15.6 High accelerated life test
  • 15.7 Vibration, shock, and drop test
  • 15.8 Manufacturing conformance testing
  • 15.9 Conclusions
  • Acknowledgement
  • References
  • 16. High-power converters
  • 16.1 High-power applications
  • 16.2 Thyristor-based high-power devices
  • 16.3 High-power inverter topologies
  • 16.4 High-power dc-dc converter topologies
  • References
  • Index.

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