Heat management in integrated circuits : on-chip and system-level monitoring and cooling /

"As integrated circuits get smaller and more complex, power densities are increasing, leading to more heat generation. Dealing with this heat is fast becoming the most important design bottleneck of current and future integrated circuits, where power envelopes are defined by the ability of the...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Ogrenci-Memik, Seda (Autor)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: London, United Kingdom : The Institution of Engineering and Technology, 2015.
Colección:Materials, circuits and devices series ; 28.
Temas:
Integrated circuits > Design and construction.
Electronic circuits > Temperature compensation.
Temperature measuring instruments.
Temperature control.
Circuits intégrés > Conception et construction.
Circuits électroniques > Compensation thermique.
Thermométrie > Instruments.
Température > Régulation.
TECHNOLOGY & ENGINEERING > Mechanical.
cooling.
integrated circuit packaging.
temperature sensors.
thermal management (packaging)
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Heat in integrated circuits and systems
  • On-chip temperature sensing
  • Dynamic thermal management
  • Active cooling
  • Mitigating thermal events at the system level and above
  • Emerging directions in thermal-aware systems.

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