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Heat management in integrated circuits : on-chip and system-level monitoring and cooling /
"As integrated circuits get smaller and more complex, power densities are increasing, leading to more heat generation. Dealing with this heat is fast becoming the most important design bottleneck of current and future integrated circuits, where power envelopes are defined by the ability of the...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
London, United Kingdom :
The Institution of Engineering and Technology,
2015.
|
| Colección: | Materials, circuits and devices series ;
28. |
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 020 | |z 1849199345 |q (hardback) | ||
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| 049 | |a UAMI | ||
| 100 | 1 | |a Ogrenci-Memik, Seda, |e author. | |
| 245 | 1 | 0 | |a Heat management in integrated circuits : |b on-chip and system-level monitoring and cooling / |c Seda Ogrenci-Memik. |
| 264 | 1 | |a London, United Kingdom : |b The Institution of Engineering and Technology, |c 2015. | |
| 264 | 4 | |c ©2016 | |
| 300 | |a 1 online resource (ix, 253 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Materials, circuits and devices series ; |v 28 | |
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a Heat in integrated circuits and systems -- On-chip temperature sensing -- Dynamic thermal management -- Active cooling -- Mitigating thermal events at the system level and above -- Emerging directions in thermal-aware systems. | |
| 520 | |a "As integrated circuits get smaller and more complex, power densities are increasing, leading to more heat generation. Dealing with this heat is fast becoming the most important design bottleneck of current and future integrated circuits, where power envelopes are defined by the ability of the system to dissipate the generated heat. Thermal effects are forcing chip designers to apply conservative design margins, creating sub-optimal results. At a larger scale, cooling is the second most costly item in the electricity bills of well-designed high-performance computing and data centers, costing 30-50% of the total. Thermal monitoring and management in integrated circuits is therefore becoming increasingly important. This book covers thermal monitoring and management in integrated circuits, with a focus on devices and materials that are intimately integrated on-chip as opposed to in-package or on-board. The devices and circuits discussed include various designs used for the purpose of converting temperature to a digital measurement and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. Topics covered include an overview of heat in integrated circuits and systems, on-chip temperature sensing, dynamic thermal management, active cooling, and mitigating thermal events at the system-level and above"--Provided by publisher. | ||
| 588 | 0 | |a Print version record. | |
| 590 | |a Knovel |b ACADEMIC - Computer Hardware Engineering | ||
| 650 | 0 | |a Integrated circuits |x Design and construction. | |
| 650 | 0 | |a Electronic circuits |x Temperature compensation. | |
| 650 | 0 | |a Temperature measuring instruments. | |
| 650 | 0 | |a Temperature control. | |
| 650 | 6 | |a Circuits intégrés |x Conception et construction. | |
| 650 | 6 | |a Circuits électroniques |x Compensation thermique. | |
| 650 | 6 | |a Thermométrie |x Instruments. | |
| 650 | 6 | |a Température |x Régulation. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Mechanical. |2 bisacsh | |
| 650 | 7 | |a Electronic circuits |x Temperature compensation. |2 fast |0 (OCoLC)fst00906897 | |
| 650 | 7 | |a Integrated circuits |x Design and construction. |2 fast |0 (OCoLC)fst00975545 | |
| 650 | 7 | |a Temperature control. |2 fast |0 (OCoLC)fst01147347 | |
| 650 | 7 | |a Temperature measuring instruments. |2 fast |0 (OCoLC)fst01147370 | |
| 650 | 7 | |a cooling. |2 inspect | |
| 650 | 7 | |a integrated circuit packaging. |2 inspect | |
| 650 | 7 | |a temperature sensors. |2 inspect | |
| 650 | 7 | |a thermal management (packaging) |2 inspect | |
| 776 | 0 | 8 | |i Print version: |a Ogrenci-Memik, Seda. |t Heat management in integrated circuits. |d London, United Kingdom : The Institution of Engineering and Technology, 2015 |z 9781849199346 |w (OCoLC)935526988 |
| 830 | 0 | |a Materials, circuits and devices series ; |v 28. | |
| 856 | 4 | 0 | |u https://appknovel.uam.elogim.com/kn/resources/kpHMICOCS4/toc |z Texto completo |
| 938 | |a EBL - Ebook Library |b EBLB |n EBL4332364 | ||
| 938 | |a EBSCOhost |b EBSC |n 1140095 | ||
| 938 | |a ProQuest MyiLibrary Digital eBook Collection |b IDEB |n cis32336017 | ||
| 938 | |a YBP Library Services |b YANK |n 12802159 | ||
| 994 | |a 92 |b IZTAP | ||