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Microwave and millimeter-wave electronic packaging /
Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Boston [Massachusetts] ; London [England] :
Artech House,
2014.
|
| Colección: | Artech House microwave library.
|
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Introduction
- Materials
- Ceramic packaging
- Laminate packaging
- First-level interconnects
- Second-level interconnects
- Modules and motherboards
- Transitions and 3D packaging
- Heat transfer
- Electromagnetic modeling
- Conclusions and future horizons.