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Microwave and millimeter-wave electronic packaging /
Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Boston [Massachusetts] ; London [England] :
Artech House,
2014.
|
| Colección: | Artech House microwave library.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 100 | 1 | |a Sturdivant, Rick, |e author. | |
| 245 | 1 | 0 | |a Microwave and millimeter-wave electronic packaging / |c Rick Sturdivant. |
| 264 | 1 | |a Boston [Massachusetts] ; |a London [England] : |b Artech House, |c 2014. | |
| 264 | 4 | |c ©2014 | |
| 300 | |a 1 online resource (281 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Artech House Microwave Library | |
| 504 | |a Includes bibliographical references at the end of each chapters and index. | ||
| 588 | 0 | |a Print version record. | |
| 520 | |a Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. -- |c Edited summary from book. | ||
| 505 | 0 | |a Introduction -- Materials -- Ceramic packaging -- Laminate packaging -- First-level interconnects -- Second-level interconnects -- Modules and motherboards -- Transitions and 3D packaging -- Heat transfer -- Electromagnetic modeling -- Conclusions and future horizons. | |
| 590 | |a Knovel |b ACADEMIC - Electronics & Semiconductors | ||
| 590 | |a eBooks on EBSCOhost |b EBSCO eBook Subscription Academic Collection - Worldwide | ||
| 650 | 0 | |a Microelectronic packaging. | |
| 650 | 6 | |a Mise sous boîtier (Microélectronique) | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Mechanical. |2 bisacsh | |
| 650 | 7 | |a Microelectronic packaging. |2 fast |0 (OCoLC)fst01019751 | |
| 776 | 0 | 8 | |i Print version: |a Sturdivant, Rick. |t Microwave and millimeter-wave electronic packaging. |d Boston, [Massachusetts] ; London, [England] : Artech House, ©2014 |h xvii, 261 pages |k Artech House microwave library. |z 9781608076970 |
| 830 | 0 | |a Artech House microwave library. | |
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| 938 | |a IEEE |b IEEE |n 9100896 | ||
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