Microwave and millimeter-wave electronic packaging /

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Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Sturdivant, Rick (Autor)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Boston [Massachusetts] ; London [England] : Artech House, 2014.
Colección:Artech House microwave library.
Temas:
Microelectronic packaging.
Mise sous boîtier (Microélectronique)
TECHNOLOGY & ENGINEERING > Mechanical.
Acceso en línea:Texto completo
Descripción
Sumario:Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --
Descripción Física:1 online resource (281 pages) : illustrations
Bibliografía:Includes bibliographical references at the end of each chapters and index.
ISBN:9781608076987
1608076989
1608076970
9781608076970
9781523117420
1523117427

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