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Robust design of microelectronics assemblies against mechanical shock, temperature and moisture /
This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. De...
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Cambridge, UK :
Woodhead Publishing,
[2015]
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| Colección: | Woodhead Publishing series in electronic and optical materials ;
no. 81. |
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Front Cover; Related titles; Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and MoistureWoodhead Publishing Series i ... ; Copyright; Contents; Woodhead Publishing Series in Electronic and Optical Materials; Foreword; Preface; 1
- Introduction; 1.1 Introduction to microelectronic packaging; 1.2 Introduction to robust design; 1.3 Organisation of the book; References; Part 1
- Advances in robust design against temperature-induced failures; 2
- Robust design of microelectronic assemblies against mismatched thermal expansion; 2.1 Introduction; 2.2 Fundamentals
- 2.3 Comprehensive analysis of a bilayer structure2.4 Microelectronic assembly as a sandwich structure with a continuous bonding layer; 2.5 PCB assembly as a sandwich structure with a layer of solder joints; References; 2. Appendix: prior published works in thermoelasticity; 2. Nomenclature; 2. Mathematical symbols; 3
- Advances in creep-fatigue modelling of solder joints; 3.1 Introduction; 3.2 Life-prediction models for creep-fatigue; 3.3 The unified equation; 3.4 Self-validations and benchmarking; 3.5 Applications; References
- Part 2
- Advances in robust design against moisture-induced failures4
- Moisture properties and their characterisations; 4.1 Introduction; 4.2 Thermodynamics of water; 4.3 Sorption and its characterisation; 4.4 Diffusivity and its characterisation; 4.5 Hygroscopic swelling and its characterisation; References; 5
- Advances in diffusion and vapour pressure modelling; 5.1 The discontinuity of concentration; 5.2 The fractional saturation; 5.3 Diffusion under time-varying temperature and pressure; 5.4 Advances in vapour pressure modelling; References; Part 3
- Robust design against drop impact
- 6
- The physics of failure of portable electronic devices in drop impact6.1 Product drop testing; 6.2 The physics of failure; References; 7
- Subsystem testing of solder joints against drop impact; 7.1 Board-level testing; 7.2 Component-level testing; References; 8
- Fatigue resistance of solder joints: strain-life representation; 8.1 Introduction; 8.2 Design of test specimens; 8.3 Fatigue resistance equations: materials; 8.4 Fatigue resistance equations: frequency; 8.5 Fatigue resistance equations: environment; References; 9
- Fatigue crack growth in solder joints at high strain rate
- 9.1 Introduction9.2 Establishment of continuous crack growth tracking capability; 9.3 Crack propagation characteristics: board-level drop shock test; 9.4 Crack propagation characteristics: high-speed cyclic bending test; 9.5 Three-dimensional fracture mechanics modelling of the crack front; 9.6 Crack propagation in the solder joints of a mobile phone experiencing drop impact; References; 10
- Dynamic deformation of a printed circuit board in drop-shock; 10.1 Introduction; 10.2 Vibration of a test board in the JESD22-B111 drop-shock test