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Robust design of microelectronics assemblies against mechanical shock, temperature and moisture /
This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. De...
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Cambridge, UK :
Woodhead Publishing,
[2015]
|
| Colección: | Woodhead Publishing series in electronic and optical materials ;
no. 81. |
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 100 | 1 | |a Wong, E.-H. |q (Ee-Hua), |e author. | |
| 245 | 1 | 0 | |a Robust design of microelectronics assemblies against mechanical shock, temperature and moisture / |c E.-H. Wong and Y.-W. Mai. |
| 264 | 1 | |a Cambridge, UK : |b Woodhead Publishing, |c [2015] | |
| 300 | |a 1 online resource | ||
| 336 | |a text |b txt |2 rdacontent | ||
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| 490 | 1 | |a Woodhead Publishing series in electronic and optical materials ; |v number 81 | |
| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Vendor-supplied metadata. | |
| 520 | |a This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. Detailed chapters cover: temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. -- |c Edited summary from book. | ||
| 505 | 0 | |a Front Cover; Related titles; Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and MoistureWoodhead Publishing Series i ... ; Copyright; Contents; Woodhead Publishing Series in Electronic and Optical Materials; Foreword; Preface; 1 -- Introduction; 1.1 Introduction to microelectronic packaging; 1.2 Introduction to robust design; 1.3 Organisation of the book; References; Part 1 -- Advances in robust design against temperature-induced failures; 2 -- Robust design of microelectronic assemblies against mismatched thermal expansion; 2.1 Introduction; 2.2 Fundamentals | |
| 505 | 8 | |a 2.3 Comprehensive analysis of a bilayer structure2.4 Microelectronic assembly as a sandwich structure with a continuous bonding layer; 2.5 PCB assembly as a sandwich structure with a layer of solder joints; References; 2. Appendix: prior published works in thermoelasticity; 2. Nomenclature; 2. Mathematical symbols; 3 -- Advances in creep-fatigue modelling of solder joints; 3.1 Introduction; 3.2 Life-prediction models for creep-fatigue; 3.3 The unified equation; 3.4 Self-validations and benchmarking; 3.5 Applications; References | |
| 505 | 8 | |a Part 2 -- Advances in robust design against moisture-induced failures4 -- Moisture properties and their characterisations; 4.1 Introduction; 4.2 Thermodynamics of water; 4.3 Sorption and its characterisation; 4.4 Diffusivity and its characterisation; 4.5 Hygroscopic swelling and its characterisation; References; 5 -- Advances in diffusion and vapour pressure modelling; 5.1 The discontinuity of concentration; 5.2 The fractional saturation; 5.3 Diffusion under time-varying temperature and pressure; 5.4 Advances in vapour pressure modelling; References; Part 3 -- Robust design against drop impact | |
| 505 | 8 | |a 6 -- The physics of failure of portable electronic devices in drop impact6.1 Product drop testing; 6.2 The physics of failure; References; 7 -- Subsystem testing of solder joints against drop impact; 7.1 Board-level testing; 7.2 Component-level testing; References; 8 -- Fatigue resistance of solder joints: strain-life representation; 8.1 Introduction; 8.2 Design of test specimens; 8.3 Fatigue resistance equations: materials; 8.4 Fatigue resistance equations: frequency; 8.5 Fatigue resistance equations: environment; References; 9 -- Fatigue crack growth in solder joints at high strain rate | |
| 505 | 8 | |a 9.1 Introduction9.2 Establishment of continuous crack growth tracking capability; 9.3 Crack propagation characteristics: board-level drop shock test; 9.4 Crack propagation characteristics: high-speed cyclic bending test; 9.5 Three-dimensional fracture mechanics modelling of the crack front; 9.6 Crack propagation in the solder joints of a mobile phone experiencing drop impact; References; 10 -- Dynamic deformation of a printed circuit board in drop-shock; 10.1 Introduction; 10.2 Vibration of a test board in the JESD22-B111 drop-shock test | |
| 590 | |a Knovel |b ACADEMIC - Electronics & Semiconductors | ||
| 650 | 0 | |a Computer engineering. | |
| 650 | 0 | |a Microelectronics |x Design. | |
| 650 | 6 | |a Ordinateurs |x Conception et construction. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Mechanical. |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Microelectronics. |2 bisacsh | |
| 650 | 7 | |a Computer engineering. |2 fast |0 (OCoLC)fst00872078 | |
| 650 | 7 | |a Microelectronics |x Design. |2 fast |0 (OCoLC)fst01019762 | |
| 700 | 1 | |a Mai, Y. W., |d 1946- |e author. | |
| 776 | 0 | 8 | |i Print version: |a Wong, E- H. |t Robust design of microelectronics assemblies against mechanical schock, temperature and moisture. |d Boston, MA : Elsevier, [2015] |k Woodhead Publishing series in electronic and optical materials ; number 81 |x 2050-1501 |z 9781845695286 |w (DLC) 18461254 |
| 830 | 0 | |a Woodhead Publishing series in electronic and optical materials ; |v no. 81. | |
| 856 | 4 | 0 | |u https://appknovel.uam.elogim.com/kn/resources/kpRDMAAMS1/toc |z Texto completo |
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