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Robust design of microelectronics assemblies against mechanical shock, temperature and moisture /
This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. De...
| Clasificación: | Libro Electrónico |
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| Autores principales: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Cambridge, UK :
Woodhead Publishing,
[2015]
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| Colección: | Woodhead Publishing series in electronic and optical materials ;
no. 81. |
| Temas: | |
| Acceso en línea: | Texto completo |
| Sumario: | This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. Detailed chapters cover: temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. -- |
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| Descripción Física: | 1 online resource |
| Bibliografía: | Includes bibliographical references and index. |
| ISBN: | 9780857099112 0857099116 1845695283 9781845695286 |
| ISSN: | 2050-1501 |