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20231027140348.0 |
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150109t20142014ohuao o 101 0 eng d |
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|z (OCoLC)923571138
|z (OCoLC)929147993
|z (OCoLC)961579108
|z (OCoLC)962700715
|z (OCoLC)1162278890
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|a TK7871
|b .I884 2014eb
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4 |
|a 621.381
|2 23
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| 049 |
|
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|a UAMI
|
| 111 |
2 |
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|a International Symposium for Testing and Failure Analysis
|n (40th :
|d 2014 :
|c Houston, Tex.)
|
| 245 |
1 |
0 |
|a ISTFA 2014 :
|b conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA /
|c organized by Electronic Device Failure Analysis Society, ASM International.
|
| 264 |
|
1 |
|a Materials Park, Ohio :
|b ASM International,
|c 2014.
|
| 264 |
|
4 |
|c ©2014
|
| 300 |
|
|
|a 1 online resource (560 pages) :
|b color illustrations, photographs
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| 336 |
|
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|a text
|b txt
|2 rdacontent
|
| 337 |
|
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|a computer
|b c
|2 rdamedia
|
| 338 |
|
|
|a online resource
|b cr
|2 rdacarrier
|
| 500 |
|
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|a Includes index.
|
| 588 |
0 |
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|a Online resource; title from PDF title page (ebrary, viewed January 9, 2014).
|
| 505 |
0 |
|
|a Title Page -- TitlePage_2014 -- COPYRight Page -- EDFAS 2014 Board of Directors -- Organizing Committee-2014 -- Technical Program Committee -- 2014 -- Contents_2014 -- ISTFA2014_Combined -- cp2014istfa001 -- cp2014istfa005 -- cp2014istfa006 -- cp2014istfa012 -- cp2014istfa023 -- cp2014istfa028 -- cp2014istfa033 -- cp2014istfa038 -- cp2014istfa043 -- cp2014istfa049 -- cp2014istfa055 -- cp2014istfa065 -- cp2014istfa073 -- cp2014istfa082 -- cp2014istfa087 -- cp2014istfa094 -- cp2014istfa100 -- cp2014istfa105 -- cp2014istfa110
|
| 505 |
8 |
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|a Cp2014istfa115cp2014istfa125 -- cp2014istfa130 -- cp2014istfa136 -- cp2014istfa143 -- cp2014istfa148 -- cp2014istfa152 -- cp2014istfa156 -- cp2014istfa166 -- cp2014istfa172 -- cp2014istfa178 -- cp2014istfa184 -- Combined_189-536 -- Analysis of InGaAs Epi Defects by Conductive AFM -- Failure analysis of bit line to SNC leakage fail in 2xnm DRAM using Nano- Probing technique -- Analysis of an Anomalous CMOS Transistor Exhibiting Drain to Source Leakage � Its Model and Cause -- Feature Based Non-Destructive Fault Isolation in Advanced IC Packages
|
| 505 |
8 |
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|a Understanding the Cu Void Formation by TEM Failure AnalysismicroPREPTM -- A New Laser Tool for High-Throughput Sample Preparation -- Using Energy Dispersive Spectroscopy (EDS) to Determine the Resistance of FIB Jumpers for Circuit Edit -- New Ion Source for High Precision FIB Nanomachining and Circuit Edit -- Evaluation of Power SiC-MOSFET Using Super-Higher-Order Scanning Nonlinear Dielectric Microscopy: Imaging of Carrier Distribution and Depletion Layer -- Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips
|
| 505 |
8 |
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|a Methods to Reconstruct SEM and Optical Probe Tips using a FIB ToolNear-Field Scanning Optical Microscopy for Through-Silicon Imaging and Fault Isolation of Integrated Circuits -- Characterization and simulation of a body biased structure in triple-well technology under pulsed photoelectric laser stimulation -- Continuous-wave 1064nm laser for Laser Voltage Imaging and Probing Applications -- Marginal Failure Diagnosed with LADA: Case Studies. -- Sample Preparation for High Numerical Aperture Solid Immersion Lens Laser Imaging -- TDR Analysis On Short Transmission Lines
|
| 505 |
8 |
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|a Productive Polishing TEM Sample Preparation Methodology DevelopmentOptimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images -- Delayering on Advanced Process Technologies using FIB -- Failure Analysis Enhancement by Incorporating a Compact Scan Diagnosis System -- Debugging Phase-Locked Loop Failures in Integrated Circuit Products -- A Novel Method for the Specified Site Planar View TEM Sample Preparation -- Investigation of Protection Layer Materials for Ex-situ �lift-out� TEM Sample Preparation with FIB for 14nm FinFET
|
| 546 |
|
|
|a English.
|
| 590 |
|
|
|a Knovel
|b ACADEMIC - Metals & Metallurgy
|
| 590 |
|
|
|a Knovel
|b ACADEMIC - Nondestructive Testing & Evaluation
|
| 650 |
|
0 |
|a Electronics
|x Materials
|x Testing
|v Congresses.
|
| 650 |
|
0 |
|a Electronic apparatus and appliances
|x Testing
|v Congresses.
|
| 650 |
|
6 |
|a Appareils électroniques
|x Essais
|v Congrès.
|
| 650 |
|
7 |
|a Electronic apparatus and appliances
|x Testing.
|2 fast
|0 (OCoLC)fst00906837
|
| 650 |
|
7 |
|a Electronics
|x Materials
|x Testing.
|2 fast
|0 (OCoLC)fst00907571
|
| 655 |
|
7 |
|a Conference papers and proceedings.
|2 fast
|0 (OCoLC)fst01423772
|
| 710 |
2 |
|
|a Electronic Device Failure Analysis Society,
|e organizer.
|
| 710 |
2 |
|
|a ASM International,
|e organizer.
|
| 776 |
0 |
8 |
|i Print version:
|a International Symposium for Testing and Failure Analysis (40th : 2014 : Houston, Tex.).
|t ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA.
|d Materials Park, Ohio : ASM International, ©2014
|h xx, 540 pages
|z 9781627080743
|
| 856 |
4 |
0 |
|u https://appknovel.uam.elogim.com/kn/resources/kpISTFAC31/toc
|z Texto completo
|
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|a BATCHLOAD
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|a EBL - Ebook Library
|b EBLB
|n EBL3002486
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|a ebrary
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|n ebr10998999
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|a YBP Library Services
|b YANK
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