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Understanding smart sensors /

Now in its third edition, Understanding Smart Sensors is the most complete, up-to-date, and authoritative summary of the latest applications and developments impacting smart sensors in a single volume. This thoroughly expanded and revised edition of an Artech bestseller contains a wealth of new mate...

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Detalles Bibliográficos
Clasificación:	Libro Electrónico
Autor principal:	Frank, Randy
Formato:	Electrónico eBook
Idioma:	Inglés
Publicado:	Boston : Artech House, [2013]
Edición:	Third edition.
Colección:	Artech House integrated microsystems series.
Temas:	Detectors > Design and construction. Programmable controllers. Signal processing > Digital techniques. Semiconductors. Application-specific integrated circuits. Semiconductors Automates programmables. Traitement du signal > Techniques numériques. Semi-conducteurs. Circuits intégrés à la demande. semiconductor. TECHNOLOGY & ENGINEERING > Technical & Manufacturing Industries & Trades. Application-specific integrated circuits Detectors > Design and construction Programmable controllers Signal processing > Digital techniques
Acceso en línea:	Texto completo

Tabla de Contenidos:

Machine generated contents note: ch. 1 Smart Sensor Basics
1.1. Introduction
1.2. Mechanical-Electronic Transitions in Sensing
1.3. Nature of Sensors
1.4. Integration of Micromachining and Microelectronics
1.5. Application Example
1.6. Summary
References
Selected Bibliography
ch. 2 Micromachining
2.1. Introduction
2.2. Bulk Micromachining
2.3. Wafer Bonding
2.3.1. Silicon-on-Silicon Bonding
2.3.2. Silicon-on-Glass (Anodic) Bonding
2.3.3. Silicon Fusion Bonding
2.3.4. Wafer Bonding for More Complex Structures and Adding ICs
2.4. Surface Micromachining
2.4.1. Squeeze-Film Damping
2.4.2. Stiction
2.4.3. Particulate Control
2.4.4.Combinations of Surface and Bulk Micromachining
2.5. Other Micromachining Techniques
2.5.1. The LIGA Process
2.5.2. Dry Etching Processes
2.5.3. Micromilling
2.5.4. Lasers in Micromachining
2.6.Combining MEMS with IC Fabrication
2.7. Other Micromachined Materials
2.7.1. Diamond as an Alternate Sensor Material
2.7.2. Metal Oxides and Piezoelectric Sensing
2.7.3. Films on Microstructures
2.7.4. Micromachining Metal Structures
2.7.5. Carbon Nanotube MEMS
2.8. MEMS Foundry Services and Software Tools
2.9. Application Example
2.10. Summary
References
Selected Bibliography
ch. 3 The Nature of Semiconductor Sensor Output
3.1. Introduction
3.2. Sensor Output Characteristics
3.2.1. Wheatstone Bridge
3.2.2. Piezoresistivity in Silicon
3.2.3. Semiconductor Sensor Definitions
3.2.4. Static Versus Dynamic Operation
3.3. Other Sensing Technologies
3.3.1. Capacitive Sensing
3.3.2. Piezoelectric Sensing
3.3.3. The Hall-Effect
3.3.4. Chemical Sensors
3.3.5. Improving Sensor Characteristics
3.4. Digital Output Sensors
3.4.1. Incremental Optical Encoders
3.4.2. Digital Techniques
3.5. Noise/Interference Aspects
3.6. Low Power, Low Voltage Sensors
3.6.1. Impedance
3.7. Analysis of Sensitivity Improvement
3.7.1. Thin Diaphragm
3.7.2. Increase Diaphragm Area
3.7.3. Improve Topology
3.8. Application Example
3.9. Summary
References
ch. 4 Getting Sensor Information Into the Microcontroller
4.1. Introduction
4.2. Amplification and Signal Conditioning
4.2.1. Instrumentation Amplifiers
4.2.2. Sleep-Mode Circuitry for Reducing Power
4.2.3. Rail to Rail Operational Amplifiers
4.2.4. Switched-Capacitor Amplifier
4.2.5. Barometer Application Circuit
4.2.6.4- to 20-mA Signal Transmitter
4.2.7. Schmitt Trigger
4.3. Separate Versus Integrated Signal Conditioning
4.3.1. Integrated Signal Conditioning
4.3.2. External Signal Conditioning
4.4. Digital Conversion
4.4.1.A/D Converters
4.4.2. Performance of A/D Converters
4.4.3. Implications of A/D Accuracy and Errors
4.5. On-Line Tool for Evaluating a Sensor Interface Design
4.6. Application Example
4.7. Summary
References
Selected Bibliography
ch. 5 Using MCUs/DSPs to Increase Sensor IQ
5.1. Introduction
5.1.1. Other IC Technologies
5.1.2. Logic Requirements
5.2. MCU Control
5.3. MCUs for Sensor Interface
5.3.1. Peripherals
5.3.2. Memory
5.3.3. Input/Output
5.3.4. On-Board A/D Conversion
5.3.5. Power Saving Capability
5.3.6. Local Voltage or Current Regulation
5.4. DSP Control
5.4.1. Digital Signal Controllers
5.4.2. Field Programmable Gate Arrays
5.4.3. Algorithms Versus Look-Up Tables
5.5. Techniques and Systems Considerations
5.5.1. Linearization
5.5.2. PWM Control
5.5.3. Autozero and Autorange
5.5.4. Diagnostics
5.5.5. Reducing EMC/RFI
5.5.6. Indirect (Computed not Sensed) Versus Direct Sensing
5.6. Software, Tools, and Support
5.6.1. Design-in Support
5.7. Sensor Integration
5.8. Application Example
5.9. Summary
References
ch. 6 Communications for Smart Sensors
6.1. Introduction
6.2. Background and Definitions
6.2.1. Definitions
6.2.2. Background
6.3. Sources (Organizations) and Standards
6.4. Automotive Protocols
6.4.1. CAN Protocol
6.4.2. LIN Protocol
6.4.3. Media Oriented Systems Transport
6.4.4. FlexRay
6.4.5. Other Automotive Protocol Aspects
6.5. Industrial Networks
6.5.1. Example Industrial Protocols
6.6. Protocols in Other Applications
6.7. Protocols in Silicon
6.7.1. MCU with Integrated CAN
6.7.2. LIN Implementation
6.7.3. Ethernet Controller
6.8. Transitioning Between Protocols
6.9. Application Example
6.10. Summary
References
Additional References
ch. 7 Control Techniques
7.1. Introduction
7.1.1. Programmable Logic Controllers
7.1.2. Open-Versus Closed-Loop Systems
7.1.3. PID Control
7.2. State Machines
7.3. Fuzzy Logic
7.4. Neural Networks
7.5.Combined Fuzzy Logic and Neural Networks
7.6. Adaptive Control
7.6.1. Observers for Sensing
7.7. Other Control Areas
7.7.1. RISC Versus CISC
7.8. Impact of Artificial Intelligence
7.9. Application Example
7.10. Summary
References
ch. 8 Wireless Sensing
8.1. Introduction
8.1.1. The RF Spectrum
8.1.2. Spread Spectrum
8.2. Wireless Data and Communications
8.3. Wireless Sensing Networks
8.3.1. ZigBee
8.3.2. ZigBee-Like Wireless
8.3.3. ANT+
8.3.4.6LoWPAN
8.3.5. Near Field Communication (NFC)
8.3.6.Z-Wave
8.3.7. Dust Networks
8.3.8. Other RF Wireless Solutions
8.3.9. Optical Signal Transmission
8.4. Industrial Wireless Sensing Networks
8.5. RF Sensing
8.5.1. Surface Acoustic Wave Devices
8.5.2. Radar
8.5.3. Light Detection and Ranging (LIDAR)
8.5.4. Global Positioning System
8.5.5. Remote Emissions Sensing
8.5.6. Remote Keyless Entry
8.5.7. Intelligent Transportation System
8.5.8. RF-ID
8.5.9. Other Remote Sensing
8.6. Telemetry
8.7. RF MEMS
8.8. Application Example
8.9. Summary
References
Selected Bibliography
ch. 9 MEMS Beyond Sensors
9.1. Introduction
9.2. MEMS Actuators
9.2.1. Microvalves
9.2.2. Micromotors
9.2.3. Micropumps
9.2.4. Microdynamometer
9.2.5. Microsteam Engine
9.2.6. Actuators in Other Semiconductor Materials
9.3. Other Micromachined Structures
9.3.1. Cooling Channels
9.3.2. Microoptics
9.3.3. Microgripper
9.3.4. Microprobes
9.3.5. Micromirrors
9.3.6. Heating Elements
9.3.7. Thermionic Emitters
9.3.8. Field Emission Devices
9.3.9. Unfoldable Microelements
9.3.10. Micronozzles
9.3.11. Interconnects for Stacked Wafers
9.3.12. Nanoguitar
9.4. Application Example
9.5. Summary
References
ch. 10 Packaging, Testing, and Reliability Implications of Smarter Sensors
10.1. Introduction
10.2. Semiconductor Packaging Applied to Sensors
10.2.1. Increased Pin Count
10.3. Hybrid Packaging
10.3.1. Ceramic Packaging and Ceramic Substrates
10.3.2. Multichip Modules
10.3.3. Dual-Chip Packaging
10.3.4. BGA Packaging
10.4.Common Packaging for Sensors
10.4.1. Plastic Packaging
10.4.2. Surface-Mount Packaging
10.4.3. Flip-Chip
10.4.4. Wafer-Level Packaging
10.4.5.3-D Packaging
10.5. Reliability Implications
10.5.1. The Physics of Failure
10.5.2. Wafer-Level Sensor Reliability
10.6. Testing Smarter Sensors
10.7. Application Example
10.8. Summary
References
ch. 11 Mechatronics and Sensing Systems
11.1. Introduction
11.1.1. Integration and Mechatronics
11.2. Smart-Power ICs
11.3. Embedded Sensing
11.3.1. Temperature Sensing
11.3.2. Current Sensing in Power ICs
11.3.3. Diagnostics
11.3.4. MEMS Relays
11.4. Other System Aspects
11.4.1. Batteries
11.4.2. Field Emission Displays
11.4.3. System Voltage Transients, Electrostatic Discharge, and Electromagnetic Interference
11.5. Application Example
11.6. Summary
References
ch. 12 Standards for Smart Sensing
12.1. Introduction
12.2. Setting the Standards for Smart Sensors and Systems
12.3. IEEE 1451.1
12.3.1.Network-Capable Application Processor
12.3.2.Network Communication Models
12.4. IEEE 1451.2
12.4.1. STIM
12.4.2. Transducer Electronic Data Sheet
12.4.3. TII
12.4.4. Calibration/Correction Engine
12.4.5. Sourcing Power to STIMs
12.4.6. Representing Physical Units in the TEDS
12.5. IEEE 1451.3
12.6. IEEE 1451.4
12.7. IEEE 1451.5
12.8. IEEE P1451.6
12.9. IEEE 1451.7
12.10. Extending the System to the Network
12.11.
Application Example
12.12. Summary
References
Selected Bibliography
ch.
13 More Standards Impacting Sensors
13.1. Introduction
13.2. Sensor Plug and Play
13.3. Universal Serial Bus
13.4. Development Tools Establish De Facto Standards
13.5. Alternate Standards
13.5.1. Airplane Networks
13.5.2. Automotive Safety Network
13.5.3. Another Automotive Safety Network
13.5.4. Automotive Sensor Protocol
13.6. Consumer/Cell Phone Apps
13.7. Application Example
13.8. Summary
References
ch. 14 Sensor Fusion
14.1. Introduction
14.2. Sensor and Other Fusion Background
14.3. Automotive Applications
14.3.1. Ranging and Vision
14.3.2. Sensor Fusion for Virtual Sensors
14.3.3. Autonomous Driving
14.4. Industrial (Robotic) Applications
14.5. Consumer Applications
14.5.1. Fusion Software in the Sensor
14.5.2. Separate Fusion Software
14.5.3. Flexible Fusion Software
14.5.4. Agnostic Sensor Fusion
14.5.5. Simulation and Testing
14.6. Application Example
14.7. Summary
References
Selected Bibliography
ch. 15 Energy Harvesting for Wireless Sensor Nodes
15.1. Introduction
15.2. Applications Drive Technology Implementation and Development
15.2.1. Structural Health Monitoring
15.2.2. Building Automations Systems
15.2.3. Industrial Applications
15.2.4. Automotive
15.2.5. Aircraft
15.2.6. Portable Consumer
15.2.7. Remote Distributed Applications
15.3.Complete System Consideration
15.4. EH Technologies
15.4.1. Thermoelectric EH
15.4.2. Piezoelectric EH
15.4.3. Photovoltaic EH
15.4.4. Electromagnetic EH
15.4.5. RF EH
15.4.6. Electromechanical EH
15.4.7. Multiple Energy Sources
15.4.8. Future Concepts
Note continued: 15.5. Energy Storage
15.5.1. Batteries
15.5.2. Ultracapacitors
15.6. Energy Budget
15.6.1. Power Management ICs
15.6.2. MCUs
15.6.3. Wireless Transmission
15.6.4. Sensor Power Consumption
15.7. Development Systems
15.8. Application Example
15.9. Summary
References
Selected Bibliography
ch. 16 The Next Phase of Sensing Systems
16.1. Introduction
16.2. Future Sensor Plus Semiconductor Capabilities
16.2.1. Monolithic Versus Package-Level Integration
16.3. Future System Requirements
16.3.1. Sensing in Automobiles
16.3.2. Sensing in Smart Phones
16.3.3. Health Care Sensors
16.4. Software, Sensing, and the System
16.4.1. Sensor Apps
16.4.2. Cloud Sensing
16.5. Trusted Sensing
16.6. Alternate Views of Smart Sensing
16.7. The Smart Loop
16.8. Application Example
16.9. Summary
Acknowledgment
References
Selected Bibliography
Appendix A
List of Web Sites for Additional Smart Sensor and MEMS Information
Selected Bibliography
Smart Sensor Acronym Decoder and Glossary.

Understanding smart sensors /

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