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Encyclopedia of thermal packaging. Set 1, Thermal packaging techniques. Volumes 1-6 /
The first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology "building blocks" used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for ac...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor Corporativo: | |
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Singapore ; Hackensack, N.J. :
World Scientific Pub. Co.,
©2013.
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| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 245 | 0 | 0 | |a Encyclopedia of thermal packaging. |n Set 1, |p Thermal packaging techniques. |n Volumes 1-6 / |c edited-in-chief, Avram Bar-Cohen. |
| 260 | |a Singapore ; |a Hackensack, N.J. : |b World Scientific Pub. Co., |c ©2013. | ||
| 300 | |a 1 online resource | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 504 | |a Includes bibliographical references and index. | ||
| 520 | |a The first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology "building blocks" used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual "building blocks" and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These "building blocks" are the essential elements in the creation of a complete, cost-effective thermal management system. The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging "learning curve", the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering. | ||
| 505 | 0 | |a Ch. 1. Introduction. 1.1. Physics and applications of microchannels. 1.2. Use of microchannels in electronics cooling -- chapter 2. Design and optimization of single-phase microchannel heat sinks. 2.1. Prediction of heat transfer coefficient. 2.2. Prediction of pressure drop. 2.3. Optimization of heat transfer performance. 2.4. Importance of inlet manifold design. 2.5. Hot-spot thermal management. 2.6. System-level design and optimization -- chapter 3. Two-phase operation of microchannel heat sinks. 3.1. Fundamentals of two-phase transport in microchannel. 3.2. Macroscale versus microscale boiling. 3.3. Flow regime maps -- chapter 4. Boiling heat transfer at small scales. 4.1. Saturated boiling in microchannels. 4.2. Heat transfer in boiling and two-phase flow. 4.3. Effect of geometrical and flow parameters. 4.4. Empirical predictions of thermal performance. 4.5. Physics-based modeling of boiling heat transfer -- 5. Pressure drop in two-phase flow. 5.1. Two-phase flow pressure drop. 5.2. Empirical prediction of two-phase pressure drop. 5.3. Regime-based modeling of two-phase pressure drop -- 6. Micropumps and pumping requirements. 6.1. Microscale pumping technologies. 6.2. Mechanical displacement micropumping techniques. 6.3. Electro- and magneto-kinetic micropumping techniques. 6.4. Pump selection -- 7. Challenges in implementation. 7.1. Effect of dissolved air on system performance. 7.2. System instabilities for boiling in microchannels. 7.3. Critical heat flux -- chapter 8. Measurement techniques. 8.1. Conventional techniques. 8.2. Microscale temperature measurement. 8.3. Optical flow measurements. 8.4. Micro-PIV and IR Micro-PIV. 8.5. Laser-induced fluorescence thermometry. | |
| 506 | |a Access restricted to Ryerson students, faculty and staff. |5 CaOTR | ||
| 590 | |a Knovel |b ACADEMIC - Electrical & Power Engineering | ||
| 590 | |a Knovel |b ACADEMIC - Electronics & Semiconductors | ||
| 650 | 0 | |a Electronic packaging. | |
| 650 | 0 | |a Heat sinks (Electronics) | |
| 650 | 0 | |a Insulation (Heat) | |
| 650 | 6 | |a Mise sous boîtier (Électronique) | |
| 650 | 6 | |a Dissipateurs thermiques (Électronique) | |
| 650 | 7 | |a Electronic packaging. |2 fast |0 (OCoLC)fst00907414 | |
| 650 | 7 | |a Heat sinks (Electronics) |2 fast |0 (OCoLC)fst00953979 | |
| 650 | 7 | |a Insulation (Heat) |2 fast |0 (OCoLC)fst00974462 | |
| 700 | 1 | |a Bar-Cohen, Avram, |d 1946- | |
| 710 | 2 | |a World Scientific (Firm) | |
| 776 | 0 | 8 | |i Print version: |z 9789814313780 |
| 776 | 0 | 8 | |i Print version: |z 9789814313803 |
| 856 | 4 | 0 | |u https://appknovel.uam.elogim.com/kn/resources/kpETPSTPT5/toc |z Texto completo |
| 994 | |a 92 |b IZTAP | ||