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Datacom equipment power trends and cooling applications.

"Gives data center facility designers and manufacturers a clear understanding of their facilities' design needs and allows them to accurately predict the equipment loads their facilities will need to accommodate. Also includes air and liquid cooling options that may be considered"--

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: American Society of Heating, Refrigerating and Air-Conditioning Engineers
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Atlanta, GA : American Society of Heating, Refrigerating, and Air-Conditioning Engineers, 2012.
Edición:2nd ed.
Colección:ASHRAE datacom series ; bk. 2.
Temas:
Acceso en línea:Texto completo

MARC

LEADER 00000cam a2200000 a 4500
001 KNOVEL_ocn827583428
003 OCoLC
005 20231027140348.0
006 m o d
007 cr cnu---unuuu
008 130213s2012 gaua ob 001 0 eng d
040 |a N$T  |b eng  |e pn  |c N$T  |d YDXCP  |d KNOVL  |d OCLCQ  |d ZCU  |d OCLCQ  |d VT2  |d REB  |d JBG  |d OCLCF  |d CEF  |d RRP  |d AU@  |d WYU  |d YOU  |d STF  |d OCLCQ  |d OCLCO  |d OCLCQ  |d OCLCO 
019 |a 961848647  |a 988673056  |a 999477411  |a 1026436604  |a 1066432224 
020 |a 9781461918196  |q (electronic bk.) 
020 |a 1461918197  |q (electronic bk.) 
020 |a 9781680153217  |q (electronic bk.) 
020 |a 1680153218  |q (electronic bk.) 
020 |z 9781936504282 
020 |z 1936504286 
029 1 |a GBVCP  |b 804267073 
035 |a (OCoLC)827583428  |z (OCoLC)961848647  |z (OCoLC)988673056  |z (OCoLC)999477411  |z (OCoLC)1026436604  |z (OCoLC)1066432224 
050 4 |a TK7870.25  |b .D38 2012eb 
072 7 |a TEC  |x 005050  |2 bisacsh 
082 0 4 |a 697.9/316  |2 23 
049 |a UAMI 
245 0 0 |a Datacom equipment power trends and cooling applications. 
250 |a 2nd ed. 
260 |a Atlanta, GA :  |b American Society of Heating, Refrigerating, and Air-Conditioning Engineers,  |c 2012. 
300 |a 1 online resource (132 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a ASHRAE datacom series ;  |v bk. 2 
504 |a Includes bibliographical references (pages 123-124) and index. 
520 |a "Gives data center facility designers and manufacturers a clear understanding of their facilities' design needs and allows them to accurately predict the equipment loads their facilities will need to accommodate. Also includes air and liquid cooling options that may be considered"--  |c Provided by publisher 
588 0 |a Print version record. 
505 0 |a Machine generated contents note: 1. Introduction -- 1.1. Purpose/Objective -- 2. Background -- 2.1. Datacom Facility Planning -- 2.2. Simple Example of Datacom Equipment Growth Impact on a Facility -- 2.3. Overview of Power Density Definitions -- 2.4. IT and Facility Industry Collaboration -- 2.5. IT Industry Background -- 3.Component Power Trends -- 3.1. Introduction -- 3.2. Servers and Their Components -- 3.3. Server Power Distribution -- 3.4.Component Power Trends -- 3.5. Power Supplies -- 4. Load Trends and Their Application -- 4.1. Introduction -- ASHRAE Updated and Expanded Air-Cooling Power Trends -- 4.2. Definition of Watts per Equipment Square Foot Metric -- 4.3. The 2005 ASHRAE Power Trend Chart -- 4.4. Power Trend Chart Evolution -- 4.5. Volume Servers -- 4.6. Idle Power For Servers -- 4.7. ASHRAE Liquid-Cooling Power Trends -- 4.8. Product Cycle vs. Building Life Cycle -- 4.9. Predicting Future Loads -- 4.10. Provisioning for Future Loads -- 5. Air Cooling of Computer Equipment 
505 0 |a Note continued: 5.1. Introduction -- 5.2. Air Cooling Overview -- 5.3. Underfloor Distribution -- 5.4. Overhead Distribution -- 5.5. Managing Supply and Return Airflows -- 5.6. Local Distribution -- 5.7. Air-Cooling Equipment -- 5.8. Air-Cooling Controls -- 5.9. Reliability -- 6. Liquid Cooling of Computer Equipment -- 6.1. Introduction -- 6.2. Liquid Cooling Overview -- 6.3. Liquid-Cooled Computer Equipment -- 6.4. Liquid Coolants for Computer Equipment -- 6.5. Datacom Facility Chilled-Water System -- 6.6. Reliability -- 7. Practical Example of Trends to Data Center Design -- 7.1. Introduction -- Introduction to Appendices -- Appendix A Glossary -- Appendix B Additional Power Trend Chart Information/Data -- Appendix C Electronics, Semiconductors, Microprocessors, ITRS -- C.1. Cost-Performance Processors -- C.2. High-Performance Processors -- C.3. Post CMOS. 
590 |a Knovel  |b ACADEMIC - Mechanics & Mechanical Engineering 
650 0 |a Electronic apparatus and appliances  |x Cooling. 
650 0 |a Telecommunication  |x Equipment and supplies  |x Cooling. 
650 0 |a Air conditioning  |x Design and construction. 
650 0 |a Electronic data processing departments  |x Design and construction. 
650 6 |a Appareils électroniques  |x Refroidissement. 
650 7 |a TECHNOLOGY & ENGINEERING  |x Construction  |x Heating, Ventilation & Air Conditioning.  |2 bisacsh 
650 7 |a Air conditioning  |x Design and construction  |2 fast 
650 7 |a Electronic apparatus and appliances  |x Cooling  |2 fast 
710 2 |a American Society of Heating, Refrigerating and Air-Conditioning Engineers. 
776 0 8 |i Print version:  |t Datacom equipment power trends and cooling applications.  |b 2nd ed.  |d Atlanta, GA : American Society of Heating, Refrigerating, and Air-Conditioning Engineers, 2012  |z 9781936504282  |w (DLC) 2012014005  |w (OCoLC)784126004 
830 0 |a ASHRAE datacom series ;  |v bk. 2. 
856 4 0 |u https://appknovel.uam.elogim.com/kn/resources/kpDEPTCAE1/toc  |z Texto completo 
938 |a EBSCOhost  |b EBSC  |n 519605 
938 |a YBP Library Services  |b YANK  |n 10250222 
994 |a 92  |b IZTAP