Adhesives technology for electronic applications : materials, processing, reliability /

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This text presents a comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, it includes new developments in anisotropic, electrically conductive, and underfill adhesives.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Licari, James J., 1930-
Otros Autores: Swanson, Dale W.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Amsterdam ; Boston : William Andrew Pub., 2011.
Edición:2nd ed.
Colección:Materials and processes for electronic applications series.
Temas:
Electronics > Materials.
Adhesives.
Electronic packaging.
Adhesives
Électronique > Matériaux.
Adhésifs.
Mise sous boîtier (Électronique)
adhesive.
Electronic packaging
Electronics > Materials
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Machine generated contents note: 1.Introduction
  • 2.Functions and theory of adhesives
  • 3.Chemistry, Formulation, and Properties of Adhesives
  • 4.Adhesive Bonding Processes
  • 5.Applications
  • 6.Reliability
  • 7.Test and Inspection Methods.

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