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Adhesives technology for electronic applications : materials, processing, reliability /
This text presents a comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, it includes new developments in anisotropic, electrically conductive, and underfill adhesives.
| Clasificación: | Libro Electrónico |
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| Autor principal: | |
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Amsterdam ; Boston :
William Andrew Pub.,
2011.
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| Edición: | 2nd ed. |
| Colección: | Materials and processes for electronic applications series.
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| Temas: | |
| Acceso en línea: | Texto completo |