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Adhesives technology for electronic applications : materials, processing, reliability /
This text presents a comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, it includes new developments in anisotropic, electrically conductive, and underfill adhesives.
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Amsterdam ; Boston :
William Andrew Pub.,
2011.
|
| Edición: | 2nd ed. |
| Colección: | Materials and processes for electronic applications series.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 020 | |a 9781437778908 |q (electronic bk.) | ||
| 020 | |a 1437778909 |q (electronic bk.) | ||
| 020 | |a 9781437778892 | ||
| 020 | |a 1437778895 | ||
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| 050 | 4 | |a TK7871 |b .L53 2011eb | |
| 082 | 0 | 4 | |a 621.381 |2 23 |
| 049 | |a UAMI | ||
| 100 | 1 | |a Licari, James J., |d 1930- | |
| 245 | 1 | 0 | |a Adhesives technology for electronic applications : |b materials, processing, reliability / |c James J. Licari and Dale W. Swanson. |
| 250 | |a 2nd ed. | ||
| 260 | |a Amsterdam ; |a Boston : |b William Andrew Pub., |c 2011. | ||
| 300 | |a 1 online resource (viii, 403 pages) : |b illustrations. | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Materials and processes for electronic applications series | |
| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Print version record. | |
| 505 | 0 | |a Machine generated contents note: 1.Introduction -- 2.Functions and theory of adhesives -- 3.Chemistry, Formulation, and Properties of Adhesives -- 4.Adhesive Bonding Processes -- 5.Applications -- 6.Reliability -- 7.Test and Inspection Methods. | |
| 520 | 8 | |a This text presents a comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, it includes new developments in anisotropic, electrically conductive, and underfill adhesives. | |
| 590 | |a Knovel |b ACADEMIC - Electronics & Semiconductors | ||
| 590 | |a Knovel |b ACADEMIC - Adhesives Coatings Sealants And Inks | ||
| 650 | 0 | |a Electronics |x Materials. | |
| 650 | 0 | |a Adhesives. | |
| 650 | 0 | |a Electronic packaging. | |
| 650 | 2 | |a Adhesives | |
| 650 | 6 | |a Électronique |x Matériaux. | |
| 650 | 6 | |a Adhésifs. | |
| 650 | 6 | |a Mise sous boîtier (Électronique) | |
| 650 | 7 | |a adhesive. |2 aat | |
| 650 | 7 | |a Adhesives |2 fast | |
| 650 | 7 | |a Electronic packaging |2 fast | |
| 650 | 7 | |a Electronics |x Materials |2 fast | |
| 700 | 1 | |a Swanson, Dale W. | |
| 776 | 0 | 8 | |i Print version: |a Licari, James J., 1930- |t Adhesives technology for electronic applications. |b 2nd ed. |d Amsterdam ; Boston : William Andrew Pub., 2011 |z 9781437778892 |w (DLC) 2011292645 |w (OCoLC)754186880 |
| 830 | 0 | |a Materials and processes for electronic applications series. | |
| 856 | 4 | 0 | |u https://appknovel.uam.elogim.com/kn/resources/kpATEAMP01/toc |z Texto completo |
| 938 | |a YBP Library Services |b YANK |n 6943436 | ||
| 994 | |a 92 |b IZTAP | ||