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|a 621.381
|2 23
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| 049 |
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|a UAMI
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| 111 |
2 |
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|a International Symposium for Testing and Failure Analysis
|n (36th :
|d 2010 :
|c Dallas, Tex.)
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| 245 |
1 |
0 |
|a ISTFA 2010 :
|b conference proceedings from the 36th International Symposium for Testing and Failure Analysis, November 14-18, 2010, InterContinental Hotel Dallas, Dallas, Texas, USA /
|c sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2010, ASM International.
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| 264 |
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1 |
|a Materials Park, Ohio :
|b ASM International,
|c 2010.
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| 300 |
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|a 1 online resource (xix, 464 pages) :
|b color illustrations
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
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|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 588 |
0 |
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|a Online resource; title from PDF title page (EBSCO, viewed July 7, 2017).
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| 504 |
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|a Includes bibliographical references and index.
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| 505 |
0 |
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|a Contents -- Combining High-Resolution Pulsed TIVA and Nanoprobing Techniques to Identify Drive Strength Issues in Mixed-signal Circuits -- Laser Voltage Imaging: A new Perspective of Laser Voltage Probing -- Two-Photon X-Variation Mapping Based on a Diode-Pumped Femtosecond Laser -- Quantitative, nanoscale free-carrier concentration mapping using terahertz near-field nanoscopy -- Laser-Thermal Imaging -- Mobile Diffractive Solid Immersion Lens Design for Backside Laser Based Fault Localization -- Volume Electrical Failure Analysis for Product-Specific Yield Enhancement
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| 505 |
8 |
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|a Case Study in Fault Isolation of a Metal Short for Yield EnhancementFailure Analysis Methodology on Systematic defect in ADC_PLL Ring Pattern due to Plasma De-chuck Process -- Fault Isolation of Sub-surface Leakage Defects Using Electron Beam Induced Current Characterization in Next-Generation Flash Memory Technology Development -- A case study: Observation of counter doping of gate poly and its validation in high density 90nm CMOS SRAM Bitcell -- Magnetic Microscopy for 3D structures: use of the Simulation Approach for the precise localization of deep buried weak currents
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| 505 |
8 |
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|a Advanced Sample Preparation Method for Lead Free Bump IMC and Solder Grain Image EnhancementExtending Acoustic Microscopy for Comprehensive Failure Analysis Applications -- Process induced defects in the silicon substrate: Approaches for successful Failure Analysis. -- X-sectional Scanning Capacitance Microscopy (SCM) Applications on Deep Submicron Devices at Specific Sites -- High Volume and Fast Turnaround Automated Inline TEM Sample Preparation for Manufacturing Process Monitoring -- Backscattered Electron Imaging for Embedded Subtle Defects in 32nm Processes
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| 505 |
8 |
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|a Semi-Automated Full Wafer In-line SRAM Failure Analysis By Dual Beam Focused Ion Beam (FIB)Simulation Studies of Fluorine-induced Corrosion and Defects on Microchip Al Bondpads in Wafer Fabrication -- A Novel Wet Etch In-situ Decapsulation of Devices on Boards -- Low Temperature Plasma Decapsulation of Copper-wire-bonded and Exposed Copper Metallization Devices -- Decapsulation of Copper Bonded Plastic Encapsulated Integrated Circuits Utilizing Laser Ablation and Mixed Acid Chemistry
|
| 505 |
8 |
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|a Photoluminescence and EBIC for Process Control and Failure Analysis in Si-Based PhotovoltaicsCombined electron beam induced current imaging (EBIC) and focused ion beam (FIB) techniques for thin film solar cell characterization -- Activation Energy Analysis of Dark and Laser Illuminated I-V Characteristics of Thin-film Poly Silicon Solar Cells -- Characterization and failure analysis of 3D integrated semiconductor devices-novel tools for fault isolation, target preparation and high resolution material analysis -- A Novel Junction Profiling Methodology
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| 590 |
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|a Knovel
|b ACADEMIC - Nondestructive Testing & Evaluation
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| 590 |
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|a eBooks on EBSCOhost
|b EBSCO eBook Subscription Academic Collection - Worldwide
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| 650 |
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0 |
|a Electronics
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|v Congresses.
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| 650 |
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0 |
|a Electronic apparatus and appliances
|x Testing
|v Congresses.
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6 |
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| 650 |
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7 |
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7 |
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7 |
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|x Materials
|x Testing
|2 fast
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| 655 |
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|a Conference papers and proceedings
|2 fast
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| 710 |
2 |
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|a ASM International.
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| 710 |
2 |
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|a Electronic Device Failure Analysis Society.
|
| 856 |
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