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Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010 /
The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor Corporativo: | |
| Otros Autores: | |
| Formato: | Electrónico Congresos, conferencias eBook |
| Idioma: | Inglés |
| Publicado: |
Switzerland :
Trans Tech Publications,
2011.
|
| Colección: | Key engineering materials ;
v. 460-461. |
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 111 | 2 | |a International Conference on Components, Packaging and Manufacturing Technology |d (2010 : |c Sanya Shi, China) | |
| 245 | 1 | 0 | |a Components, packaging and manufacturing technology : |b selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010 / |c edited by Yanwen Wu. |
| 246 | 3 | 0 | |a 2010 International Conference on Components, Packaging and Manufacturing Technology |
| 246 | 3 | 0 | |a ICCPMT 2010 |
| 260 | |a Switzerland : |b Trans Tech Publications, |c 2011. | ||
| 300 | |a 1 online resource : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Key Engineering Materials, |x 1662-9795 ; |v Vols. 460 - 461 | |
| 504 | |a Includes bibliographical references and index. | ||
| 520 | |a The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology. This work thus constitutes a handy guide to current thinking in the field. Review from Book News Inc.: Nearly 150 selected and peer-reviewed papers discuss first advanced measurement, test, and information technology; then components, packaging, and manufacturing technology. The topics include exploring the structure of the crisis management team, the mutual information model of adaptive waveform design, counter-measures of electronic business development for Chinese travel companies, an improved attack-resistant collaborative filtering algorithm, analyzing the characteristics of textile materials based on pre-judgement mechanisms, applying chaos particle swarm optimized neural networks for evaluating credit risk, next-day load forecasting using local temperature-sensitive information, and applying data mining technology in mechanical fault diagnosis. | ||
| 588 | 0 | |a MARCXML record (Scientific.Net, crosswalked on Jan 28, 2011). | |
| 505 | 0 | |a Components, Packaging and Manufacturing Technology; Preface and Committees; Table of Contents; Chapter 1: Advanced Measurement, Test and Information Technology; Experimental Investigation of Static Characteristics on Eddy Current Sensor for External Cylindrical Grinding Measurement System; Nondestructive Determination of Citric Acid Using Successive Projections Algorithm and Spectroscopic Techniques; Exploring the Structure of the Crisis Management Team; How the Swine Lineage Influenza A (H1N1) Virus Spread?; Product Form Design Based on Neural Network and Genetic Algorithm. | |
| 505 | 8 | |a Numerical Simulation of Hydro-Forming Cylindrical Cup with a Hemispherical BottomRapid Establishment of 3D Intricate Design Platform Based on Modular Technology by UG; Virtual Product Development and Reliability Design of Camera Cover; Finite Element Analysis of Cold Expanding of Hollow Thin-Wall Tube; Query-Focused Multi-Documents Summarization Using Genetic Algorithm; Particle Swarm Optimization Using Various Inertia Factor Variants; Quantum Computing-Based Ant Colony Optimization Algorithm and Performance Analysis. | |
| 505 | 8 | |a Evaluation and Measurement Method for Texture Depth of Exposed-Aggregate Cement Concrete Pavement Surface Based on Digital Imaging TechniqueDrawing and Analyzing Project Governance Social Networks; Local Maximum Absorption Method for Structure Fitting in CryoEM; A Review of Synthetic Aperture Radar Seeker Related Technology Research; Measurement of Composition Variation of Municipal Solid Waste Incineration (MSWI) Fly Ash during Thermal Treatment; A CSCW-Enabling Integrated Access Control Model and its Application; A GA Based Measurement Method for Discontinuous Curve Fitting. | |
| 505 | 8 | |a Calibration Method Using Concentric Circles Planar Template and its ApplicationHoles Machining Process Optimization with Genetic Algorithm; The Study of Risk Caused by Personnel Change of Organs and Institutions; Research of Word Sense Disambiguation Based on Soft Pattern; Research on Image Restoration Algorithm Base on ACO-BP Neural Network; An Urban Traffic Network Analysis Method Based on EPs; Improved Methods on Association Rules Mining Algorithms; An Approach to the Characteristic Spectrum Analysis for Train Wheelset Fault Diagnosis. | |
| 505 | 8 | |a Fast and Non-Destructiveness Discrimination of Varieties of Fragrant Mushroom Using Near Infrared SpectroscopyFormulate Neighborhood for Multi-Relational Data by Cell Accumulating; The Research of Ontology Mapping Based on PSO Algorithm; Study on Material Stacking Image Based on Machine Vision; Moving Horizon Model Inversion for Nonlinear ILC; Vibration Analysis for the Gate Rotor of the Single Screw Compressor Based on Wavelet Finite Element. | |
| 505 | 8 | |a ANP Evaluation on the Comprehensive Benefit of Land Consolidation Project in the Arid Areas of Northwest China -- Illustrated by the Case of Gaoyan Mountain Land Consolidation Project in Yuzhong County of Lanzhou. | |
| 590 | |a Knovel |b ACADEMIC - Manufacturing Engineering | ||
| 650 | 0 | |a Electronic apparatus and appliances |v Congresses. | |
| 650 | 0 | |a Electronic packaging |v Congresses. | |
| 650 | 0 | |a Microelectronic packaging |v Congresses. | |
| 650 | 0 | |a Manufacturing processes |v Congresses. | |
| 650 | 6 | |a Mise sous boîtier (Électronique) |v Congrès. | |
| 650 | 6 | |a Mise sous boîtier (Microélectronique) |v Congrès. | |
| 650 | 6 | |a Fabrication |v Congrès. | |
| 650 | 7 | |a Electronic apparatus and appliances. |2 fast |0 (OCoLC)fst00906772 | |
| 650 | 7 | |a Electronic packaging. |2 fast |0 (OCoLC)fst00907414 | |
| 650 | 7 | |a Manufacturing processes. |2 fast |0 (OCoLC)fst01008139 | |
| 650 | 7 | |a Microelectronic packaging. |2 fast |0 (OCoLC)fst01019751 | |
| 655 | 7 | |a Conference papers and proceedings. |2 fast |0 (OCoLC)fst01423772 | |
| 700 | 1 | |a Wu, Yanwen. |4 edt | |
| 830 | 0 | |a Key engineering materials ; |v v. 460-461. | |
| 856 | 4 | 0 | |u https://appknovel.uam.elogim.com/kn/resources/kpCPMT0008/toc |z Texto completo |
| 938 | |a Trans Tech Publications, Ltd |b TRAN |n 10.4028/www.scientific.net/KEM.460-461 | ||
| 938 | |a ProQuest Ebook Central |b EBLB |n EBL1872517 | ||
| 938 | |a ebrary |b EBRY |n ebr10604250 | ||
| 994 | |a 92 |b IZTAP | ||