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Lithography process control /

This text covers lithography process control at several levels, from fundamental through advanced topics. The book is a self-contained tutorial that works both as an introduction to the technology and as a reference for the experienced lithographer. It reviews the foundations of statistical process...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Levinson, Harry J.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Bellingham, Wash. : SPIE Optical Engineering Press, ©1999.
Colección:Tutorial texts in optical engineering ; v. TT 28.
Temas:
Acceso en línea:Texto completo
Tabla de Contenidos:
  • ch. 1. Introduction to the use of statistical process control in lithography
  • ch. 2. Sampling
  • ch. 3. Simple and complex processes
  • ch. 4. Linewidth control
  • ch. 5. Overlay
  • ch. 6. Yield
  • ch. 7. Process drift and automatic process control
  • ch. 8. Metrology
  • ch. 9. Control of operations.
  • 1. Introduction to the use of statistical process control in lithography
  • The assumptions underlying statistical process control
  • The properties of statistical process control
  • Situations in lithography where statistical process control cannot be applied naively
  • Non-normal distributions
  • Process capability
  • 2. Sampling
  • Choosing the proper sample size
  • Measurement location considerations
  • Correlations
  • Measurement frequency
  • Systematic sources of variation
  • 3. Simple and complex processes
  • Definitions
  • Why test wafers are useful
  • How to address complex processes in lithography
  • Distinguishing between layer-specific and equipment-specific effects
  • 4. Linewidth control
  • Cause and effect
  • Independent variables
  • Exposure dose
  • Resist thickness
  • Focus
  • Bake temperatures
  • Resist development
  • Humidity
  • DUV resists--special considerations
  • Contributions from reticles
  • Maximizing the process window
  • 5. Overlay
  • Overlay models
  • Matching
  • Contributions from processing and alignment mark optimization
  • Addressing the problem of non-normal distributions
  • Outliers
  • 6. Yield
  • Yield monitor strategy
  • Yield models
  • Parameters which affect yield
  • 7. Process drift and automatic process control
  • Adjusting for process drift
  • The exponentially-weighted moving average
  • Automatic process control
  • 8. Metrology
  • The need for understanding the measurement process: defect detection
  • Linewidth measurement using scanning electron microscopes
  • Electrical linewidth measurement
  • Measurement error budgets
  • Measurement of overlay
  • 9. Control of operations
  • Self-control
  • Documentation
  • ISO 9000.