MEMS packaging /

MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industrie...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: INSPEC (Information service)
Otros Autores: Hsu, Tai-Ran
Formato: Electrónico eBook
Idioma:Inglés
Publicado: London : INSPEC, ©2004.
Colección:EMIS processing series ; no. 3.
Temas:
Microelectromechanical systems.
Microelectronic packaging.
Micro-Electrical-Mechanical Systems
Microsystèmes électromécaniques.
Mise sous boîtier (Microélectronique)
Microelectromechanical systems
Microelectronic packaging
Bauelement
Mikroelektronik
Mikromechanik
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Editor; Authors; Abbreviations; Introductory statements; Introduction; 1. Fundamentals of MEMS packaging; 2. Joining and bonding technologies; 3. Sealing technologies; 4. Packing of microsystems; 5. Automated microassembly; 6. Testing and design for test; 7. MEMS packaging in the life sciences; 8. RF and optical packaging in telecommunications and other applications; 9. Aerospace applications; Appendix 1: Glossary; Appendix 2: Other resources; Subject Index

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