Cargando…
MEMS packaging /
MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industrie...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor Corporativo: | |
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
London :
INSPEC,
©2004.
|
| Colección: | EMIS processing series ;
no. 3. |
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
| LEADER | 00000cam a2200000 a 4500 | ||
|---|---|---|---|
| 001 | KNOVEL_ocn692197050 | ||
| 003 | OCoLC | ||
| 005 | 20231027140348.0 | ||
| 006 | m o d | ||
| 007 | cr cnu---unuuu | ||
| 008 | 101213s2004 enka ob 001 0 eng d | ||
| 040 | |a N$T |b eng |e pn |c N$T |d OCLCE |d E7B |d OCLCQ |d B24X7 |d OCLCQ |d Z@L |d CUS |d OCLCQ |d KNOVL |d DEBSZ |d ZCU |d OCLCF |d COO |d KNOVL |d YDXCP |d CNNAI |d OCLCQ |d AGLDB |d OCLCQ |d VTS |d CEF |d RRP |d OCLCO |d AU@ |d OCLCO |d YOU |d STF |d OL$ |d OCLCQ |d HS0 |d ERF |d UKBTH |d S2H |d OCLCQ |d BRF |d MM9 |d UAB |d OCLCQ |d CNNOR |d OCLCQ |d OCLCO |d OCLCQ |d OCLCO | ||
| 019 | |a 607067497 |a 646557769 |a 646822679 |a 729386039 |a 858447456 |a 978429488 |a 978866904 |a 1044328643 |a 1047938230 |a 1056439289 |a 1060902122 |a 1074315930 |a 1102559762 |a 1108923615 |a 1113055363 |a 1116144675 |a 1119128678 |a 1136392163 |a 1157032404 |a 1157555248 |a 1159647487 |a 1178680968 |a 1183864769 |a 1224452610 |a 1249100278 | ||
| 020 | |a 9781849190626 |q (electronic bk.) | ||
| 020 | |a 1849190623 |q (electronic bk.) | ||
| 020 | |a 9781615839629 |q (electronic bk.) | ||
| 020 | |a 1615839623 |q (electronic bk.) | ||
| 020 | |a 1282275119 | ||
| 020 | |a 9781282275119 | ||
| 020 | |a 9786612275111 | ||
| 020 | |a 6612275111 | ||
| 020 | |z 0863413358 | ||
| 020 | |z 9780863413353 | ||
| 029 | 1 | |a AU@ |b 000047057044 | |
| 029 | 1 | |a DEBBG |b BV043101434 | |
| 029 | 1 | |a DEBSZ |b 349582432 | |
| 029 | 1 | |a DEBSZ |b 42195003X | |
| 029 | 1 | |a GBVCP |b 803443188 | |
| 029 | 1 | |a NZ1 |b 14231878 | |
| 029 | 1 | |a NZ1 |b 15620812 | |
| 035 | |a (OCoLC)692197050 |z (OCoLC)607067497 |z (OCoLC)646557769 |z (OCoLC)646822679 |z (OCoLC)729386039 |z (OCoLC)858447456 |z (OCoLC)978429488 |z (OCoLC)978866904 |z (OCoLC)1044328643 |z (OCoLC)1047938230 |z (OCoLC)1056439289 |z (OCoLC)1060902122 |z (OCoLC)1074315930 |z (OCoLC)1102559762 |z (OCoLC)1108923615 |z (OCoLC)1113055363 |z (OCoLC)1116144675 |z (OCoLC)1119128678 |z (OCoLC)1136392163 |z (OCoLC)1157032404 |z (OCoLC)1157555248 |z (OCoLC)1159647487 |z (OCoLC)1178680968 |z (OCoLC)1183864769 |z (OCoLC)1224452610 |z (OCoLC)1249100278 | ||
| 037 | |b Knovel Corporation |n http://www.knovel.com | ||
| 042 | |a dlr | ||
| 050 | 4 | |a TK7874 |b .M46 2004eb | |
| 082 | 0 | 4 | |a 621.381 |2 22 |
| 084 | |a 53.55 |2 bcl | ||
| 084 | |a 53.32 |2 bcl | ||
| 084 | |a ZN 4980 |2 rvk | ||
| 084 | |a TEC 025f |2 stub | ||
| 049 | |a UAMI | ||
| 245 | 0 | 0 | |a MEMS packaging / |c edited by Tai-Ran Hsu. |
| 260 | |a London : |b INSPEC, |c ©2004. | ||
| 300 | |a 1 online resource (xxix, 275 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a EMIS processing series ; |v no. 3 | |
| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Print version record. | |
| 506 | |3 Use copy |f Restrictions unspecified |2 star |5 MiAaHDL | ||
| 533 | |a Electronic reproduction. |b [Place of publication not identified] : |c HathiTrust Digital Library, |d 2010. |5 MiAaHDL | ||
| 538 | |a Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. |u http://purl.oclc.org/DLF/benchrepro0212 |5 MiAaHDL | ||
| 583 | 1 | |a digitized |c 2010 |h HathiTrust Digital Library |l committed to preserve |2 pda |5 MiAaHDL | |
| 505 | 0 | |a Editor; Authors; Abbreviations; Introductory statements; Introduction; 1. Fundamentals of MEMS packaging; 2. Joining and bonding technologies; 3. Sealing technologies; 4. Packing of microsystems; 5. Automated microassembly; 6. Testing and design for test; 7. MEMS packaging in the life sciences; 8. RF and optical packaging in telecommunications and other applications; 9. Aerospace applications; Appendix 1: Glossary; Appendix 2: Other resources; Subject Index | |
| 520 | |a MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing. The Institution of Engineering and Technology is. | ||
| 546 | |a English. | ||
| 590 | |a Knovel |b ACADEMIC - Nanotechnology | ||
| 590 | |a Knovel |b ACADEMIC - Electronics & Semiconductors | ||
| 650 | 0 | |a Microelectromechanical systems. | |
| 650 | 0 | |a Microelectronic packaging. | |
| 650 | 2 | |a Micro-Electrical-Mechanical Systems | |
| 650 | 6 | |a Microsystèmes électromécaniques. | |
| 650 | 6 | |a Mise sous boîtier (Microélectronique) | |
| 650 | 7 | |a Microelectromechanical systems |2 fast | |
| 650 | 7 | |a Microelectronic packaging |2 fast | |
| 650 | 7 | |a Bauelement |2 gnd | |
| 650 | 7 | |a Mikroelektronik |2 gnd | |
| 650 | 7 | |a Mikromechanik |2 gnd | |
| 700 | 1 | |a Hsu, Tai-Ran. | |
| 710 | 2 | |a INSPEC (Information service) | |
| 776 | 0 | 8 | |i Print version: |t MEMS packaging. |d London : INSPEC, ©2004 |z 0863413358 |w (OCoLC)53030765 |
| 830 | 0 | |a EMIS processing series ; |v no. 3. | |
| 856 | 4 | 0 | |u https://appknovel.uam.elogim.com/kn/resources/kpMEMSP002/toc |z Texto completo |
| 938 | |a Books 24x7 |b B247 |n bke00000957 | ||
| 938 | |a ebrary |b EBRY |n ebr10326300 | ||
| 938 | |a EBSCOhost |b EBSC |n 292233 | ||
| 938 | |a YBP Library Services |b YANK |n 3092574 | ||
| 994 | |a 92 |b IZTAP | ||