MEMS packaging /

MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industrie...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: INSPEC (Information service)
Otros Autores: Hsu, Tai-Ran
Formato: Electrónico eBook
Idioma:Inglés
Publicado: London : INSPEC, ©2004.
Colección:EMIS processing series ; no. 3.
Temas:
Microelectromechanical systems.
Microelectronic packaging.
Micro-Electrical-Mechanical Systems
Microsystèmes électromécaniques.
Mise sous boîtier (Microélectronique)
Microelectromechanical systems
Microelectronic packaging
Bauelement
Mikroelektronik
Mikromechanik
Acceso en línea:Texto completo
Descripción
Sumario:MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing. The Institution of Engineering and Technology is.
Descripción Física:1 online resource (xxix, 275 pages) : illustrations
Bibliografía:Includes bibliographical references and index.
ISBN:9781849190626
1849190623
9781615839629
1615839623
1282275119
9781282275119
9786612275111
6612275111

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