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Adhesives technology for electronic applications : materials, processes, reliability /

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new develo...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Licari, James J., 1930-
Otros Autores: Swanson, Dale W.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Norwich, NY : William Andrew Pub., ©2005.
Colección:Materials and processes for electronic applications series.
Temas:
Acceso en línea:Texto completo

MARC

LEADER 00000cam a22000004a 4500
001 KNOVEL_ocn468750627
003 OCoLC
005 20231027140348.0
006 m o d
007 cr |n|||||||||
008 050502s2005 nyua ob 001 0 eng c
010 |a  2005012647 
040 |a COO  |b eng  |e pn  |c COO  |d KNOVL  |d DEBSZ  |d BUF  |d BAKER  |d UBY  |d E7B  |d OCLCQ  |d DEBBG  |d OCLCQ  |d KNOVL  |d OCLCF  |d OCLCO  |d OPELS  |d B24X7  |d ZCU  |d KNOVL  |d YDXCP  |d AU@  |d N$T  |d IDEBK  |d OCLCQ  |d VT2  |d UAB  |d REB  |d D6H  |d OCLCQ  |d CEF  |d RRP  |d COO  |d WYU  |d YOU  |d LEAUB  |d OCLCO  |d OCLCQ 
016 |a 000027082070  |2 AU 
019 |a 64573474  |a 69241972  |a 224377329  |a 281598690  |a 310009759  |a 505070401  |a 647802797  |a 961887431  |a 988679233  |a 999408694  |a 1026443076  |a 1058058799  |a 1065662276  |a 1087309865 
020 |a 0815515138 
020 |a 9780815515135 
020 |a 1591249422  |q (electronic bk.) 
020 |a 9781591249429  |q (electronic bk.) 
020 |a 9780080947167  |q (e-book) 
020 |a 0080947166  |q (e-book) 
020 |a 9780815516002  |q (electronic bk.) 
020 |a 0815516002  |q (electronic bk.) 
024 8 |a 2240562 
029 1 |a AU@  |b 000027082070 
029 1 |a AU@  |b 000040178746 
029 1 |a DEBBG  |b BV039834658 
029 1 |a DEBSZ  |b 33825577X 
029 1 |a DEBSZ  |b 405321422 
029 1 |a NZ1  |b 10774103 
029 1 |a NZ1  |b 15142276 
029 1 |a DEBBG  |b BV042317148 
035 |a (OCoLC)468750627  |z (OCoLC)64573474  |z (OCoLC)69241972  |z (OCoLC)224377329  |z (OCoLC)281598690  |z (OCoLC)310009759  |z (OCoLC)505070401  |z (OCoLC)647802797  |z (OCoLC)961887431  |z (OCoLC)988679233  |z (OCoLC)999408694  |z (OCoLC)1026443076  |z (OCoLC)1058058799  |z (OCoLC)1065662276  |z (OCoLC)1087309865 
037 |b Knovel Corporation  |n http://www.knovel.com 
042 |a pcc 
050 4 |a TK7871  |b .L53 2005 
072 7 |a TEC  |x 008070  |2 bisacsh 
072 7 |a TEC  |x 008060  |2 bisacsh 
082 0 4 |a 621.381  |2 22 
049 |a UAMI 
100 1 |a Licari, James J.,  |d 1930- 
245 1 0 |a Adhesives technology for electronic applications :  |b materials, processes, reliability /  |c by James J. Licari and Dale W. Swanson. 
260 |a Norwich, NY :  |b William Andrew Pub.,  |c ©2005. 
300 |a 1 online resource (xvi, 459 pages) :  |b illustrations. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a Materials and processes for electronic applications series 
504 |a Includes bibliographical references and index. 
505 0 |a Introduction -- Functions and Theory of Adhesives -- Chemistry, Formulation, and Properties of Adhesives -- Adhesive Bonding Properties -- Applications -- Reliability -- Test and Inspection Methods -- Appendix -- Conversion Factors -- Abbreviations and Acronyms -- Index. 
520 |a This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references. 
590 |a Knovel  |b ACADEMIC - Electronics & Semiconductors 
590 |a Knovel  |b ACADEMIC - Adhesives Coatings Sealants And Inks 
650 0 |a Electronics  |x Materials. 
650 0 |a Adhesives. 
650 0 |a Electronic packaging. 
650 2 |a Adhesives 
650 6 |a Électronique  |x Matériaux. 
650 6 |a Adhésifs. 
650 6 |a Mise sous boîtier (Électronique) 
650 7 |a adhesive.  |2 aat 
650 7 |a TECHNOLOGY & ENGINEERING  |x Electronics  |x Microelectronics.  |2 bisacsh 
650 7 |a TECHNOLOGY & ENGINEERING  |x Electronics  |x Digital.  |2 bisacsh 
650 7 |a Adhesives.  |2 fast  |0 (OCoLC)fst00796614 
650 7 |a Electronic packaging.  |2 fast  |0 (OCoLC)fst00907414 
650 7 |a Electronics  |x Materials.  |2 fast  |0 (OCoLC)fst00907562 
653 |a Handbooks 
700 1 |a Swanson, Dale W. 
776 0 8 |i Print version:  |a Licari, James J., 1930-  |t Adhesives technology for electronic applications.  |d Norwich, NY : William Andrew Pub., ©2005  |z 0815515138  |w (DLC) 2005012647  |w (OCoLC)60321722 
830 0 |a Materials and processes for electronic applications series. 
856 4 0 |u https://appknovel.uam.elogim.com/kn/resources/kpATEAMPRA/toc  |z Texto completo 
938 |a Books 24x7  |b B247  |n bke00032259 
938 |a Baker & Taylor  |b BKTY  |c 165.00  |d 165.00  |i 0815515138  |n 0006438625  |s active 
938 |a ebrary  |b EBRY  |n ebr10305413 
938 |a EBSCOhost  |b EBSC  |n 254143 
938 |a YBP Library Services  |b YANK  |n 3401843 
938 |a YBP Library Services  |b YANK  |n 2969852 
994 |a 92  |b IZTAP