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Modeling self-heating effects in nanoscale devices /
Accurate thermal modeling and the design of microelectronic devices and thin film structures at the micro- and nanoscales poses a challenge to electrical engineers who are less familiar with the basic concepts and ideas in sub-continuum heat transport. This book aims to bridge that gap. Efficient he...
| Clasificación: | Libro Electrónico |
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| Autores principales: | , , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
San Rafael [California] (40 Oak Drive, San Rafael, CA, 94903, USA) :
Morgan & Claypool Publishers,
[2017]
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| Colección: | IOP (Series). Release 3.
IOP concise physics. |
| Temas: | |
| Acceso en línea: | Texto completo |
| Sumario: | Accurate thermal modeling and the design of microelectronic devices and thin film structures at the micro- and nanoscales poses a challenge to electrical engineers who are less familiar with the basic concepts and ideas in sub-continuum heat transport. This book aims to bridge that gap. Efficient heat removal methods are necessary to increase device performance and device reliability. The authors provide readers with a combination of nanoscale experimental techniques and accurate modeling methods that must be employed in order to determine a device's temperature profile. |
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| Notas: | "Version: 20170801"--Title page verso. "A Morgan & Claypool publication as part of IOP Concise Physics"--Title page verso. |
| Descripción Física: | 1 online resource (various pagings) : illustrations (some color). Also available in print. |
| Público: | Researchers in semiconductor physics and materials, nanoscience and engineering, solid state electronics. |
| Bibliografía: | Includes bibliographical references. |
| ISBN: | 9781681741239 9781681742519 |
| ISSN: | 2053-2571 |