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Semiconductor packaging materials interaction and reliability /

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Detalles Bibliográficos
Clasificación:	Libro Electrónico
Otros Autores:	Chen, Andrea, Lo, Randy
Formato:	Electrónico eBook
Idioma:	Inglés
Publicado:	Boca Raton : CRC Press, 2011.
Temas:	Semiconductors > Reliability. Electronic packaging > Reliability. Materials science. Electrical engineering. Electronic books.
Acceso en línea:	Texto completo

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