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00000nam a2200000Ia 4500 |
| 001 |
ELB155191 |
| 003 |
FINmELB |
| 006 |
m o d | |
| 007 |
cr cn||||||||| |
| 008 |
101002s2011 flua sb 000 0 eng d |
| 020 |
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|z 1439862052
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| 020 |
|
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|z 9781439862056
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| 035 |
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|a (OCoLC)1287180039
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| 040 |
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|a FINmELB
|c FINmELB
|d FINmELB
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| 050 |
|
4 |
|a TK7871.85
|b S4675 2011
|
| 245 |
0 |
0 |
|a Semiconductor packaging
|h [electronic resource] :
|b materials interaction and reliability /
|c Andrea Chen, Randy Hsiao-Yu Lo.
|
| 260 |
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|a Boca Raton :
|b CRC Press,
|c 2011.
|
| 300 |
|
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|a xviii, 187 p. :
|b ill.
|
| 504 |
|
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|a Includes bibliographical references.
|
| 588 |
|
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|a Description based on metadata supplied by the publisher and other sources.
|
| 590 |
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|a Electronic reproduction. Santa Fe, Arg.: elibro, 2020. Available via World Wide Web. Access may be limited to eLibro affiliated libraries.
|
| 650 |
|
0 |
|a Semiconductors
|x Reliability.
|
| 650 |
|
0 |
|a Electronic packaging
|x Reliability.
|
| 650 |
|
0 |
|a Materials science.
|
| 650 |
|
0 |
|a Electrical engineering.
|
| 655 |
|
4 |
|a Electronic books.
|
| 700 |
1 |
|
|a Chen, Andrea.
|
| 700 |
1 |
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|a Lo, Randy.
|
| 797 |
2 |
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|a elibro, Corp.
|
| 856 |
4 |
0 |
|u https://elibro.uam.elogim.com/ereader/bidiuam/155191
|z Texto completo
|
