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|a UAMI
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| 245 |
0 |
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|a Electrodeposition :
|b properties, processes and applications /
|c Udit Surya Mohanty, editor.
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| 264 |
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1 |
|a New York :
|b Nova Science Publishers, Inc.,
|c [2012]
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| 300 |
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|a 1 online resource.
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 490 |
1 |
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|a Electrical Engineering Developments
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| 504 |
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|a Includes bibliographical references and index.
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| 588 |
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|a Description based on print version record.
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|a ""ELECTRODEPOSITION ""; ""ELECTRODEPOSITION ""; ""CONTENTS ""; ""PREFACE ""; ""A REVIEW ON THE ELECTRODEPOSITION OF NICKEL: SYNTHESIS, MAGNETIC, THERMODYNAMIC PROPERTIES AND ITS POTENTIAL APPLICATIONS ""; ""ABSTRACT ""; ""INTRODUCTION ""; ""1.1. CRYSTAL STRUCTURES OF NICKEL ""; ""1.2. SYNTHESIS ""; ""1.2.1. FCC Nickel ""; ""1.2.2. HCP Nickel""; ""1.3. MAGNETIC AND THERMODYNAMIC PROPERTIES ""; ""1.4. APPLICATIONS ""; ""CONCLUSION ""; ""REFERENCES""; ""DEPOSITION AND PROPERTIES OF ELECTROCHEMICAL COMPOSITE COATINGS ""; ""ABSTRACT ""; ""INTRODUCTION ""
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|a ""2.1. DIFFERENT TYPES OF ELECTROCHEMICAL COMPOSITE COATINGS (ECC) """"2.1.1. Nickel-Based ECC ""; ""2.1.2. Chromium-Based ECC ""; ""2.1.3. Copper-Based ECC ""; ""2.1.4. Iron-Based ECC""; ""2.1.5. Zinc-Based ECC ""; ""2.1.6. ECC Based on Noble Metals ""; ""CONCLUSION ""; ""REFERENCES ""; ""ELECTRODEPOSITION OF AU-SN ALLOYS ""; ""ABSTRACT""; ""INTRODUCTION ""; ""3.1. ELECTRODEPOSITION OF AU-SN ALLOYS FROM A SINGLE SOLUTION""; ""3.1.1. Solution Preparation ""; ""3.2. SOLUTION STABILITY ""; ""3.2.1. Solution Precipitation and Turbidity Measurements ""
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| 505 |
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|a ""3.2.2. Characterization of Precipitates """"3.2.3. UV/Vis Spectroscopy and X-Ray Photoelectron Spectroscopy Studies ""; ""3.3. MICROSTRUCTURE OF ELECTRODEPOSITED FILMS""; ""3.3.1. Microstructure of Eutectic Deposits and Reflowed Solder ""; ""3.4. RECOVERY OF AU FROM THE WASTE SOLUTION ""; ""3.5. SEQUENTIAL ELECTRODEPOSITION FROM TWO SEPARATE SOLUTIONS ""; ""3.5.1. Solution Preparation and Electrodeposition of Pure Au Films ""; ""3.5.2. Solution Preparation and Electrodeposition of Pure Sn Films ""; ""3.5.3. Microstructure of Sequentially Deposited Eutectic Alloys and Reflowed Solder""
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|a ""CONCLUSION """"ACKNOWLEDGMENTS ""; ""REFERENCES ""; ""ELECTROCHEMICAL CORROSION BEHAVIOUR OF LEAD � FREE SOLDER ALLOYS IN 3.5 % NACL SOLUTION""; ""ABSTRACT ""; ""INTRODUCTION ""; ""4.1. ELECTROCHEMICAL CORROSION STUDY OF SN-XAG-0.5 CU SOLDER ALLOYS ""; ""4. 1.1. Polarisation Study ""; ""4.1.2. Surface Characterisation Studies ""; ""4.2. ELECTROCHEMICAL CORROSION STUDY OF SN-8.5ZN-XAG-0.1AL-0.05GA SOLDER ALLOYS ""; ""4.2.1. Polarization Study ""; ""4.2.2. Surface Characterisation Studies""; ""4.3. ELECTROCHEMICAL CORROSION STUDY OF SN-8.5ZN-X AL-0.5 GA SOLDER ALLOYS ""
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|a ""4.3.1. Polarisation Study""""4.3.2. Surface Characterisation Studies: ""; ""CONCLUSION""; ""REFERENCES ""; ""PROPERTIES AND APPLICATIONS OF NICKEL COATINGS SYNTHESIZED BY PULSE ELECTRODEPOSITION""; ""ABSTRACT""; ""INTRODUCTION ""; ""5.1. THE SYNTHESIS OF NICKEL COATING WITH HIGH DENSITY NT ""; ""5.1.1. The Synthesis of Nickel Coatings with High Density NT ""; ""5.1.2. The Corrosion Property of Nickel Coating with High Density NT ""; ""5.1.3. The Semiconducting Behavior of Passive Film of NT Nickel ""; ""5.2. INHIBITION OF HYDROGEN BLISTER ON CU�SN ALLOY COATINGS ""
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| 546 |
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|a English.
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| 590 |
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|a eBooks on EBSCOhost
|b EBSCO eBook Subscription Academic Collection - Worldwide
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| 650 |
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|a Alloy plating.
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| 650 |
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0 |
|a Electroplating.
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| 650 |
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2 |
|a Electroplating
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| 650 |
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|a Dépôt électrolytique d'alliages.
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| 650 |
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|a Galvanoplastie.
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| 650 |
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|a electroplating.
|2 aat
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| 650 |
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|a TECHNOLOGY & ENGINEERING
|x Technical & Manufacturing Industries & Trades.
|2 bisacsh
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| 650 |
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|a Alloy plating
|2 fast
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| 650 |
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|a Electroplating
|2 fast
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| 700 |
1 |
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|a Mohanty, Udit Surya,
|e editor.
|
| 776 |
0 |
8 |
|i Print version:
|t Electrodeposition
|d Hauppauge, N.Y. : Nova Science Publishers, c2012.
|z 9781614708261 (hardcover)
|w (DLC) 2011026365
|
| 830 |
|
0 |
|a Electrical engineering developments series.
|
| 856 |
4 |
0 |
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