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6th Asia Conference on Mechanical and Materials Engineering, 6th ACMME 2018 : selected, peer reviewed papers from the 6th Asia Conference on Mechanical and Materials Engineering (ACMME 2018), June 15-18, 2018, Seoul, South Korea /

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: Asia Conference on Mechanical and Materials Engineering Seoul, Korea
Otros Autores: Es-Said, Omar S. (Editor )
Formato: Electrónico Congresos, conferencias eBook
Idioma:Inglés
Publicado: Zurich, Switzerland : Trans Tech Publications, Ltd., [2018]
Colección:Materials science forum ; v. 934.
Temas:
Acceso en línea:Texto completo

MARC

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245 1 0 |a 6th Asia Conference on Mechanical and Materials Engineering, 6th ACMME 2018 :  |b selected, peer reviewed papers from the 6th Asia Conference on Mechanical and Materials Engineering (ACMME 2018), June 15-18, 2018, Seoul, South Korea /  |c edited by Omar S. Es-Said. 
264 1 |a Zurich, Switzerland :  |b Trans Tech Publications, Ltd.,  |c [2018] 
264 4 |c ©2018 
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490 1 |a Materials science forum ;  |v volume 934 
505 0 |a Intro; 6th Asia Conference on Mechanical and Materials Engineering; Preface; Table of Contents; Chapter 1: Material Physics and Material Mechanics; Fluorescence Properties of Tb-Doped ZnO Porous Network Thin Film Grown on Monocrystalline Silicon Substrate; Epitaxial Growth and Characterization of Nonpolar A-Plane AlGaN-Based Multiple Quantum Wells; Thermal Management Study of LTCC PIN Photodiode Module; Investigation of Morphological and Optical Properties of Electrodeposited Cuprous Oxide (Cu2O) Thin Film Modified with Copper(II) Phthalocyanine-Tetrasulfonic Acid Tetrasodium Salt. 
505 8 |a Revealing Mechanical Strength of Nanopores Using Atomic Finite Element TechniquesMolecular Dynamics Simulations of the Shear Bands Formation of Single Crystal Bulk Copper during the High Strain Rate Compressive Process; Effect of the Adjuvants on the Properties of Superfine SnO2 Powders; Chapter 2: Polymers and Composites; Electromechanical-Conductive Natural Rubber Doped Eggshell and Eggshell Membrane for Drug Delivery and Actuator Applications. 
505 8 |a Experimental and Modeling Study on the Curing Properties of Natural Rubber Composites Filled with Varying Proportions of Carbon Black, Modified Bentonite and Raw BentoniteFabrication and Characterization of Electrospun Polysulfone (PSf) / Halloysite (HAL) Nanocomposite Membrane; Optimization Simulation of Neutron Shielding Performance of Iron/Borated-Polyethylene Composite Structure; Synthesis and Characterization of ZrB2-ZrC Composite Powders from Zircon Sand by Self-Propagating High-Temperature Synthesis Method; Chapter 3: Structural Materials and Technologies of Materials Processing. 
505 8 |a Effect of Cooling Speed on the Microstructure and Mechanical Properties of Sn-0.7Cu-0.05Ni Solder AlloyA Comparison of Gas Nitriding and Laser Nitriding on Industrial Pure Iron and Ti-Induced Iron; Effects of Rare Earth Y2O3 on the Microstructure and Wear Behaviors of Ti-6Al-4V Cladding with SiC; Method of Creation and Research Experimental Dispersed-Reinforced Materials; Effect of Deep Cryogenic Process on the Microstructure and Hardness and Wear Resistance of High Carbon Tool Steel; Effect of Shot Peening on Microstructure and Properties of 34CrMo4 Alloy. 
505 8 |a Microstructure and Mechanical Properties of High-Frequency Induction Cladding Ni-Based Alloy Coating with La2O3 AdditionElectrochemical Investigation of Stellite 6 Alloy in Morpholine Corrosive Environment; The Effect of Heat Treatment on Compression Strength of Recycled AA6061 Aluminium Chips; The Fabrication of Tissue Engineering Scaffolds by Inkjet Printing Technology; Effect of Molding Processing on Properties of YAG Porous Ceramics via Dry Pressing Molding Method; The ELID Grinding of CoCrMo Alloy Bioprosthesis and the Formation Mechanism of its Corrosion-Resistant Oxide Layer. 
504 |a Includes bibliographical references. 
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655 7 |a Conference papers and proceedings.  |2 fast  |0 (OCoLC)fst01423772 
700 1 |a Es-Said, Omar S.,  |e editor. 
830 0 |a Materials science forum ;  |v v. 934. 
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