Cargando…

Microwave power amplifier design with MMIC modules /

Solid state power amplifiers (SSPA) are a critical part of many microwave systems. Designing SSPAs with monolithic microwave integrated circuits (MMIC) has boosted device performance to much higher levels focused on PA modules. This cutting-edge book offers engineers practical guidance in selecting...

Descripción completa

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Hausman, Howard (Autor)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Norwood, MA : Artech House, [2018]
Colección:Artech House microwave library.
Temas:
Acceso en línea:Texto completo

MARC

LEADER 00000cam a2200000 i 4500
001 EBSCO_on1055828646
003 OCoLC
005 20231017213018.0
006 m o d
007 cr cn|||||||||
008 181006s2018 maua ob 001 0 eng d
040 |a YDX  |b eng  |e rda  |e pn  |c YDX  |d EBLCP  |d YDX  |d OCLCO  |d STF  |d N$T  |d OCLCF  |d OCLCQ  |d CUV  |d UKAHL  |d OCLCQ  |d IEEEE  |d K6U  |d OCLCO  |d OCLCQ  |d OCLCO  |d OCLCQ  |d OCLCO 
066 |c (S 
019 |a 1089324650  |a 1388674481 
020 |a 9781630815257  |q (electronic bk.) 
020 |a 163081525X  |q (electronic bk.) 
020 |z 9781630813468 
020 |z 163081346X 
029 1 |a AU@  |b 000065259419 
035 |a (OCoLC)1055828646  |z (OCoLC)1089324650  |z (OCoLC)1388674481 
050 4 |a TK7871.58.P6 
072 7 |a TEC  |x 009070  |2 bisacsh 
072 0 |a TEC024000 
082 0 4 |a 621.3841/2  |2 23 
049 |a UAMI 
100 1 |a Hausman, Howard,  |e author. 
245 1 0 |a Microwave power amplifier design with MMIC modules /  |c Howard Hausman. 
264 1 |a Norwood, MA :  |b Artech House,  |c [2018] 
300 |a 1 online resource :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a Artech House microwave library 
588 0 |a Print version record. 
504 |a Includes bibliographical references and index. 
505 0 |a Intro; Microwave Power Amplifier Design with MMIC Modules; Contents; Preface; Introduction; Part I: Useful Microwave Design Concepts; Part II: Designing the Power Amplifier; Part III: Designing the Power Amplifier System; Summary; Chapter 1 Introduction; 1.1 Introduction to Designing Microwave Solid State Power Amplifiers; 1.2 Applications of SSPAs; 1.3 A Typical SSPA Configuration; 1.4 Typical Documents Starting a Project; 1.5 General Format of the SCD; 1.5.1 Paragraph 1.0: Scope; 1.5.2 Paragraph 2.0: Applicable Documents; 1.5.3 Paragraph 3.0: Requirements; 1.5.4 Paragraph 4.0: Verification. 
505 8 |a 1.5.5 Paragraph 5.0: Packaging1.5.6 Paragraph 6.0: Notes; 1.6 Requirements Section of an SCD; 1.6.1 Electrical Requirements; 1.6.2 Mechanical Requirements; 1.6.3 Environmental Requirements; 1.6.4 Other Design Criteria; References; Part I Useful Microwave Design Concepts; Chapter 2 Lumped Components in RF and Microwave Circuitry; 2.1 Applicability of Lumped Element Analysis; 2.1.1 Calculating Wavelengths; 2.1.2 Example: Calculating Wavelengths for Lumped Circuit Analysis; 2.2 Capacitor Characteristics at High Frequencies; 2.2.1 Single-Layer and Multilayer Capacitor Construction. 
505 8 |a 2.2.2 High-Frequency Capacitor Models2.2.3 Capacitor Losses (Q); 2.2.4 Capacitor Resonance; 2.3 Resistor Characteristics at High Frequencies; 2.3.1 High-Frequency Surface Mount Resistors; 2.3.2 Flip-Chip Surface Mount Resistors; 2.3.3 Thick-Film and Thin-Film Surface-Mount Resistors; 2.3.4 High-Frequency Effects of Thick-Film and Thin-Film Resistors; 2.3.5 Notes on Thin-Film Resistors; 2.3.6 Notes on Thick-Film Resistors; 2.4 Inductors; 2.4.1 Calculating Inductance of a Cylindrical Coil of Wire; 2.4.2 Inductors at High Frequencies; 2.4.3 Inductors at Resonance. 
505 8 |a 2.4.4 Inductance of a Straight Wire2.4.5 Planar Spiral Inductors; 2.4.6 Conical Inductors; 2.4.7 Inductance of Via Holes; 2.4.8 Inductance of Bond Wire; 2.4.9 Inductance of Flat or Ribbon Wire; References; Chapter 3 Transmission Lines; 3.1 Introduction to Transmission Line Theory; 3.2 Common Transmission Line Topologies; 3.3 Transmission Line Characteristics Using Lumped Circuit Elements; 3.3.1 Distributed Lumped Constant Model; 3.3.2 Modeling a Microstrip Transmission Line with Distributed Lumped Elements; 3.3.3 Characteristic Impedance of Transmission Line from the Lumped Circuit Model. 
520 3 |a Solid state power amplifiers (SSPA) are a critical part of many microwave systems. Designing SSPAs with monolithic microwave integrated circuits (MMIC) has boosted device performance to much higher levels focused on PA modules. This cutting-edge book offers engineers practical guidance in selecting the best power amplifier module for a particular application and interfacing the selected module with other power amplifier modules in the system. It also explains how to identify and mitigate peripheral issues concerning the PA modules, SSPAs, and microwave systems.nnThis authoritative volume presents the critical techniques and underpinnings of SSPA design, enabling professionals to optimize device and system performance. Engineers gain the knowledge they need to evaluate the optimum topologies for the design of a chain of microwave devices, including power amplifiers. Additionally, the book addresses the interface between the microwave subsystems and the primary DC power, the control and monitoring circuits, and the thermal and EMI paths. Packed with 240 illustrations and over 430 equations, this detailed book provides the practical tools engineers need for their challenging projects in the field.  |c Publisher abstract. 
590 |a eBooks on EBSCOhost  |b EBSCO eBook Subscription Academic Collection - Worldwide 
650 0 |a Power amplifiers  |x Design and construction. 
650 0 |a Microwave amplifiers  |x Design and construction. 
650 0 |a Microwave equipment  |x Circuits. 
650 4 |a TECHNOLOGY & ENGINEERING  |x Microwaves. 
650 4 |a Microwave technology. 
650 7 |a TECHNOLOGY & ENGINEERING  |x Mechanical.  |2 bisacsh 
650 7 |a Microwave amplifiers  |x Design and construction  |2 fast 
650 7 |a Power amplifiers  |x Design and construction  |2 fast 
653 |a TECHNOLOGY & ENGINEERING / Microwaves 
653 |a Technology, Engineering, Agriculture 
653 |a Technologie, Ingenieurswissenschaft, Landwirtschaft 
653 |a Technologie, ingénierie et agriculture 
653 |a Electronics & communications engineering 
653 |a Elektronik, Nachrichtentechnik 
653 |a Ingénierie électronique et technologie des communications 
653 |a Electronics engineering 
653 |a Elektronik 
653 |a Génie électronique 
653 |a Microwave technology 
653 |a Mikrowellentechnik 
653 |a Technologie des micro-ondes 
776 0 8 |i Print version:  |a Hausman, Howard.  |t Microwave power amplifier design with MMIC modules.  |d Norwood, MA : Artech House, [2018]  |z 163081346X  |w (OCoLC)1028165298 
830 0 |a Artech House microwave library. 
856 4 0 |u https://ebsco.uam.elogim.com/login.aspx?direct=true&scope=site&db=nlebk&AN=1904374  |z Texto completo 
880 8 |6 505-00/(S  |a 3.4 Lossless Transmission Line3.5 Characteristics of a Signal Traveling Through an Infinite Transmission Line; 3.5.1 Attenuation Constant α; 3.5.2 Phase Constant β; 3.6 50Ω Transmission Lines; 3.7 Example of a Passive Microwave Circuit Using Transmission Lines at Different Impedances: Wilkinson Power Divider; References; Chapter 4 S-Parameters; 4.1 Introduction; 4.2 The S-Parameter Matrix; 4.2.1 Passive Symmetrical Devices; 4.2.2 The S-Parameter Matrix; 4.2.3 Notes on S-Parameters; 4.3 S-Parameters of Cascaded Devices: ABCD Parameters; 4.3.1 Defining ABCD Parameters. 
938 |a IEEE  |b IEEE  |n 9100050 
938 |a Askews and Holts Library Services  |b ASKH  |n AH35263288 
938 |a ProQuest Ebook Central  |b EBLB  |n EBL5528461 
938 |a YBP Library Services  |b YANK  |n 15734761 
938 |a EBSCOhost  |b EBSC  |n 1904374 
994 |a 92  |b IZTAP