Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan /

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: Electronic Packaging Interconnect Technology Symposium Fukuoka
Otros Autores: Nogita, Kazuhiro (Editor ), Salleh, Mohd Arif Anuar Mohd (Editor ), Abdullah, Mohd Mustafa Al Bakri (Editor ), Jamaludin, Liyana (Editor ), Mohd Tahir, Muhammad Faheem (Editor )
Formato: Electrónico Congresos, conferencias eBook
Idioma:Inglés
Publicado: Zurich : Trans Tech Publications Ltd, [2018]
Colección:Diffusion and defect data. Solid state phenomena ; volume 273.
Temas:
Electronic packaging > Congresses.
Electronic packaging > Materials > Congresses.
Mise sous boîtier (Électronique) > Congrès.
Mise sous boîtier (Électronique) > Matériaux > Congrès.
TECHNOLOGY & ENGINEERING > Mechanical.
Electronic packaging
Electronic packaging > Materials
Conference papers and proceedings
Acceso en línea:Texto completo
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Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan /
Publicado 2018
Texto completo
Electrónico Congresos, conferencias eBook
Mostrar todas las versiones(2)

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