Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan /

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: Electronic Packaging Interconnect Technology Symposium Fukuoka
Otros Autores: Nogita, Kazuhiro (Editor ), Salleh, Mohd Arif Anuar Mohd (Editor ), Abdullah, Mohd Mustafa Al Bakri (Editor ), Jamaludin, Liyana (Editor ), Mohd Tahir, Muhammad Faheem (Editor )
Formato: Electrónico Congresos, conferencias eBook
Idioma:Inglés
Publicado: Zurich : Trans Tech Publications Ltd, [2018]
Colección:Diffusion and defect data. Solid state phenomena ; volume 273.
Temas:
Electronic packaging > Congresses.
Electronic packaging > Materials > Congresses.
Mise sous boîtier (Électronique) > Congrès.
Mise sous boîtier (Électronique) > Matériaux > Congrès.
TECHNOLOGY & ENGINEERING > Mechanical.
Electronic packaging
Electronic packaging > Materials
Conference papers and proceedings
Acceso en línea:Texto completo

MARC

LEADER 00000cam a2200000 i 4500
001 EBSCO_on1031999704
003 OCoLC
005 20231017213018.0
006 m o d
007 cr cnu---unuuu
008 180423s2018 sz o 100 0 eng d
040 |a N$T  |b eng  |e rda  |e pn  |c N$T  |d N$T  |d OCLCF  |d K6U  |d OCLCQ  |d OCLCO  |d OCLCQ  |d OCLCO 
020 |a 9783035733242  |q (electronic bk.) 
020 |a 3035733244  |q (electronic bk.) 
020 |z 9783035713244 
029 1 |a AU@  |b 000065127146 
035 |a (OCoLC)1031999704 
050 4 |a TK7870 
072 7 |a TEC  |x 009070  |2 bisacsh 
082 0 4 |a 621.381  |2 23 
049 |a UAMI 
111 2 |a Electronic Packaging Interconnect Technology Symposium  |d (2017 :  |c Fukuoka) 
245 1 0 |a Electronic packaging interconnect technology :  |b Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan /  |c edited by Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Muhammad Faheem Mohd Tahir. 
264 1 |a Zurich :  |b Trans Tech Publications Ltd,  |c [2018] 
264 4 |c ©2018 
300 |a 1 online resource 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a Solid state phenomena ;  |v volume 273 
588 0 |a Online resource; title from PDF title page (EBSCO, viewed June 29, 2018) 
590 |a eBooks on EBSCOhost  |b EBSCO eBook Subscription Academic Collection - Worldwide 
650 0 |a Electronic packaging  |v Congresses. 
650 0 |a Electronic packaging  |x Materials  |v Congresses. 
650 6 |a Mise sous boîtier (Électronique)  |v Congrès. 
650 6 |a Mise sous boîtier (Électronique)  |x Matériaux  |v Congrès. 
650 7 |a TECHNOLOGY & ENGINEERING  |x Mechanical.  |2 bisacsh 
650 7 |a Electronic packaging  |2 fast 
650 7 |a Electronic packaging  |x Materials  |2 fast 
655 7 |a Conference papers and proceedings  |2 fast 
700 1 |a Nogita, Kazuhiro,  |e editor. 
700 1 |a Salleh, Mohd Arif Anuar Mohd,  |e editor. 
700 1 |a Abdullah, Mohd Mustafa Al Bakri,  |e editor. 
700 1 |a Jamaludin, Liyana,  |e editor. 
700 1 |a Mohd Tahir, Muhammad Faheem,  |e editor. 
830 0 |a Diffusion and defect data.  |n Pt. B,  |p Solid state phenomena ;  |v volume 273. 
856 4 0 |u https://ebsco.uam.elogim.com/login.aspx?direct=true&scope=site&db=nlebk&AN=1794585  |z Texto completo 
938 |a EBSCOhost  |b EBSC  |n 1794585 
994 |a 92  |b IZTAP 

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