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Advanced Materials Research VI.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Gupta, Prof. K. M.
Otros Autores: Firrao, Prof. Donato, Gong, Prof. Hao
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Pfaffikon : Trans Tech Publications Inc., 2016.
Colección:Key engineering materials.
Temas:
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Intro
  • Advanced Materials Research VI
  • Preface, Committees, Sponsors
  • Table of Contents
  • Chapter 1: Metals and Alloys, Processing Technology
  • Development of Diffusion Welding Process for High Temperature Materials
  • Application of Taguchi Technique to Surface-Grinding of Mold Steel
  • Effect of Copper Addition to Aluminum on its Metallurgical, Mechanical Characteristics and Surface Roughness after Rolling
  • Comparison between Addition of Titanium and Titanium Plus Boron to MgAZ31 on its Grain Size and its Mechanical Characteristics
  • Comparison between Mo Addition to Al Grain Refined by Ti and Ti+B on its Metallurgical and Mechanical Characteristics in the Cast and after ECAP Process Conditions
  • Damages Caused by Projectile Impact
  • Chapter 2: Nano- and Microscale Materials
  • Influence of Irradiation Conditions on the Properties of PTFE Micropowder
  • The Aligned Carbon Microcoils Having the Straight Type Overall Geometry
  • Effect of the SF6 Flow Injection Time on the Formation of the Carbon Coils
  • Improved Functional Capabilities of Quasi-Two-Dimensional Tungsten Oxide Nanostructures
  • Chapter 3: Materials and Technologies in Biomedicine
  • Clinical Observation of Elastic Neck Fixed Band in Thyroid Surgery
  • Failure Site and ARI Score of Rebonded Brackets Using No-Mix Adhesive Resins
  • Comparison of the Mechanical Properties of Three Commercial Orthodontic NiTi Round Archwires
  • Chapter 4: Industrial Tribology
  • Dry Sliding Wear Behaviour of Polyamides by Taguchi Method
  • Tribological Properties of CVD Diamond Films against Graphite
  • Chapter 5: Special and Functional Materials in Machinery
  • Prediction of Long-Term Creep Behavior of High Performance Composite Material for Spacecraft
  • Advances in Quaternary and Pentanary Semiconductors for Communication and Networking Applications.