Advanced Materials Research VI.
Clasificación: | Libro Electrónico |
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Autor principal: | |
Otros Autores: | , |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
Pfaffikon :
Trans Tech Publications Inc.,
2016.
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Colección: | Key engineering materials.
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Temas: | |
Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Intro
- Advanced Materials Research VI
- Preface, Committees, Sponsors
- Table of Contents
- Chapter 1: Metals and Alloys, Processing Technology
- Development of Diffusion Welding Process for High Temperature Materials
- Application of Taguchi Technique to Surface-Grinding of Mold Steel
- Effect of Copper Addition to Aluminum on its Metallurgical, Mechanical Characteristics and Surface Roughness after Rolling
- Comparison between Addition of Titanium and Titanium Plus Boron to MgAZ31 on its Grain Size and its Mechanical Characteristics
- Comparison between Mo Addition to Al Grain Refined by Ti and Ti+B on its Metallurgical and Mechanical Characteristics in the Cast and after ECAP Process Conditions
- Damages Caused by Projectile Impact
- Chapter 2: Nano- and Microscale Materials
- Influence of Irradiation Conditions on the Properties of PTFE Micropowder
- The Aligned Carbon Microcoils Having the Straight Type Overall Geometry
- Effect of the SF6 Flow Injection Time on the Formation of the Carbon Coils
- Improved Functional Capabilities of Quasi-Two-Dimensional Tungsten Oxide Nanostructures
- Chapter 3: Materials and Technologies in Biomedicine
- Clinical Observation of Elastic Neck Fixed Band in Thyroid Surgery
- Failure Site and ARI Score of Rebonded Brackets Using No-Mix Adhesive Resins
- Comparison of the Mechanical Properties of Three Commercial Orthodontic NiTi Round Archwires
- Chapter 4: Industrial Tribology
- Dry Sliding Wear Behaviour of Polyamides by Taguchi Method
- Tribological Properties of CVD Diamond Films against Graphite
- Chapter 5: Special and Functional Materials in Machinery
- Prediction of Long-Term Creep Behavior of High Performance Composite Material for Spacecraft
- Advances in Quaternary and Pentanary Semiconductors for Communication and Networking Applications.