Advances in chemical mechanical planarization (CMP) /

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Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planar...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Babu, S. V. (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Waltham, MA : Woodhead Publishing, [2016]
Colección:Woodhead Publishing series in electronic and optical materials ; no. 86.
Temas:
Chemical mechanical planarization.
Nanoelectronics.
Microelectronics.
Miniaturization
Planarisation chimicomécanique.
Nanoélectronique.
Microélectronique.
microelectronics.
TECHNOLOGY & ENGINEERING > Mechanical.
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Part One: CMP of dielectric and metal films: 1. Chemical and physical mechanisms of dielectric chemical mechanical polishing (CMP) / Y. Moon
  • 2. Copper chemical mechanical planarization (Cu CMP) challenges in 22 nm back-end-of-line (BEOL) and beyond / M. Krishnan & M.F. Lofaro
  • 3. Electrochemical techniques and their applications for chemical mechanical planarization (CMP) of metal films / D. Roy
  • 4. Ultra low-k materials and chemical mechanical planarization (CMP) / J. Nalaskowski & S.S. Papa Rao
  • 5. CMP processing of high mobility channel materials: alternatives to Si / P. Ong & L. Teugels
  • 6. Multiscale modeling of chemical mechanical planarization (CMP) / W. Fan & D. Boning
  • 7. Polishing of SiC films / U.R.K. Lagudu
  • 8. Chemical and physical mechanisms of CMP of gallium nitride / H. Aida
  • 9. Abrasive-free and ultra-low abrasive chemical mechanical polishing (CMP) processes / N.K. Penta
  • 10. Environmental aspects of planarization processes / D.E. Speed.
  • Part Two: Consumables and process control for improved CMP: 11. Preparation and characterization of slurry for chemical mechanical planarization (CMP) / J. Seo & U. Pail
  • 12. Chemical metrology methods for CMP quality / K. Pate & P. Safier
  • 13. Diamond disc pad conditioning in chemical mechanical polishing / Z.C. Li, E.A. Baisie, X.H. Zhang & Q. Zhang
  • 14. Characterization of surface processes during oxide CMP by in situ FTIR spectroscopy / U. Künzelmann & H. Schumacher
  • 15. A novel slurry injection system for CMP / L. Borucki
  • 16. Chemical mechanical polishing (CMP) removal rate uniformity and role of carrier parameters / M. Tsujimura
  • 17. Approaches to defect characterization, mitigation and reduction / W.-T. Tseng
  • 18. Applications of chemical mechanical planarization (CMP) to more than Moore devices / G. Zwicker
  • 19. CMP for phase change materials / Z. Song & L. Wang.

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