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Advanced functional materials : selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China /

Collection of selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China. The 127 papers are grouped as follows: Symposium E: Materials in Microelectronic and Optoelectronic Industry; Symposium G: Multiferroic Materials; Symposium H: Smart Mate...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: Chinese Materials Congress Chengdu, China
Otros Autores: Han, Yafang (Editor ), Gu, Zhongwei (Editor ), Fu, Qiang, 1963- (Editor )
Formato: Electrónico Congresos, conferencias eBook
Idioma:Inglés
Publicado: Pfäffikon, Switzerland : Trans Tech Publications Ltd, 2015.
Colección:Materials science forum ; v. 815.
Temas:
Acceso en línea:Texto completo

MARC

LEADER 00000cam a2200000Ii 4500
001 EBSCO_ocn909898007
003 OCoLC
005 20231017213018.0
006 m o d
007 cr cn|||||||||
008 150425t20152015sz a ob 101 0 eng d
040 |a E7B  |b eng  |e rda  |e pn  |c E7B  |d EBLCP  |d CUS  |d OCLCO  |d OCLCQ  |d OCLCO  |d YDXCP  |d OCLCQ  |d WAU  |d LLB  |d OCLCF  |d OCLCQ  |d TTECH  |d N$T  |d OCLCO  |d OCLCQ 
019 |a 908100909  |a 913798003  |a 927293351 
020 |a 3038267805  |q (e-book) 
020 |a 9783038267805  |q (electronic bk.) 
020 |z 9783038353942 
035 |a (OCoLC)909898007  |z (OCoLC)908100909  |z (OCoLC)913798003  |z (OCoLC)927293351 
050 4 |a TK7871  |b .C456 2015eb 
082 0 4 |a 621.381  |2 23 
049 |a UAMI 
111 2 |a Chinese Materials Congress  |d (2014 :  |c Chengdu, China) 
245 1 0 |a Advanced functional materials :  |b selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China /  |c edited by Yafang Han, Zhongwei Gu and Qiang Fu. 
264 1 |a Pfäffikon, Switzerland :  |b Trans Tech Publications Ltd,  |c 2015. 
264 4 |c ©2015 
300 |a 1 online resource (712 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a Materials Science Forum,  |x 1662-9752 ;  |v Volume 815 
504 |a Includes bibliographical references at the end of each chapters and indexes. 
588 0 |a Online resource; title from PDF title page (ebrary, viewed April 25, 2015). 
505 0 |a Advanced Functional Materials; Preface; Table of Contents; Symposium E: Materials in Microelectronic and Optoelectronic Industry; Process Control of Buried Layer Epitaxy by Barrel Type Furnace; Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing; Research on Surface Roughness of Acid Etched Silicon Wafers; Investigation of Chemical Vapor Deposited Graphene Film on Oxide Substrate; Ultrahigh Purity Copper Alloy Target Used Innanoscale ULSI Interconnects; Property of an AlGaN/GaN MIS Diode with Si3N4/Al2O3 Bilayer Gate Dielectric Films. 
505 8 |a A New Type of Self-Aligned Technology for RF and Microwave Graphene Field-Effect TransistorsElectron Beam Annealing for Component Optimization in Si-Sb-Te Material; Structures and Electronic Properties of a Si55 Cluster on DFTB Calculations; Surface Plasmon Enhanced Photoluminescence of the Rubrene Film by Silver Nanoparticles; Development of Precious Metal and its Alloy Sputtering Targets with High Performance; Rheological and Thermomechanical Properties of Meso and Non-Porous Silica Filled Epoxy Composites; Study of Black Center in Silicon Wafer for Solar Cell. 
505 8 |a Impurity Detection Method for High-Purity BCl3First-Principles Study on Electronic and Optical Properties of Kesterite and Stannite Cu2ZnSnS4 Photovoltaic Absorbers; Effect of Acetic Acid/Water Ratio on the Microstructure and Properties of LaNiO3 Thin Films by Metal Organic Solution Deposition; Symposium F: Electronic Materials; Effects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn-3.0Ag-0.5Cu Solder during Thermal Cycling. 
505 8 |a Nickel Nanoparticles Mediated Growth of the Intermetallic Compound between Sn-1.0Ag-Xni Solders Alloy and Cu SubstrateEffect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder; Influence of Dislocation Density on Micromechanical Characteristics of Cu6Sn5 and Cu3Sn; Microstructure and Dielectric Properties of (Ba, Ta) Co-Doped Sr2Nb2O7 Ceramics; Effect of Ag Addition on Growth of the Interfacial Intermetallic Compounds between Sn-0.7Cu Solder and Cu Substrate. 
505 8 |a Ferroelectric and Photovoltaic Properties of Mn-Doped Bismuth Ferrite Thin FilmsMagnetic Properties and Unusual Morphologies of Barium Ferrites Prepared by Electrospinning and Sol-Gel Auto-Combustion Method; Symposium G: Multiferroic Materials; Effects of Sm and Mn Co-Doping on Structural and Optical Properties of BiFeO3 Thin Films Prepared by Sol-Gel Technique; Effects of Ba and Ti Codoping on Stoichiometric and Nonstoichiometric BiFeO3 Multiferroic Ceramics; A Review on the Characteristics of the New Multiferroic Three-Ply Structure Ferroelectric-Ferromagnetic Nanocomposite. 
520 |a Collection of selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China. The 127 papers are grouped as follows: Symposium E: Materials in Microelectronic and Optoelectronic Industry; Symposium G: Multiferroic Materials; Symposium H: Smart Materials; Symposium I: Vanadium-Titanium And Rare Earth Functional Materials; Symposium J: Biomedical Materials; Symposium K: High Performance And Functional Polymer and Composite Materials. 
590 |a eBooks on EBSCOhost  |b EBSCO eBook Subscription Academic Collection - Worldwide 
650 0 |a Electronics  |x Materials  |v Congresses. 
650 0 |a Smart materials  |x Research  |v Congresses. 
650 0 |a Rare earths  |x Research  |v Congresses. 
650 0 |a Biomedical materials  |x Research  |v Congresses. 
650 0 |a Composite materials  |x Research  |v Congresses. 
650 0 |a Polymers  |x Research  |v Congresses. 
650 6 |a Électronique  |x Matériaux  |v Congrès. 
650 6 |a Matériaux intelligents  |x Recherche  |v Congrès. 
650 6 |a Terres rares  |x Recherche  |v Congrès. 
650 6 |a Composites  |x Recherche  |v Congrès. 
650 6 |a Polymères  |x Recherche  |v Congrès. 
650 7 |a Biomedical materials  |x Research.  |2 fast  |0 (OCoLC)fst00832595 
650 7 |a Composite materials  |x Research.  |2 fast  |0 (OCoLC)fst00871724 
650 7 |a Electronics  |x Materials.  |2 fast  |0 (OCoLC)fst00907562 
650 7 |a Polymers  |x Research.  |2 fast  |0 (OCoLC)fst01070636 
650 7 |a Smart materials  |x Research.  |2 fast  |0 (OCoLC)fst01121554 
655 7 |a Conference papers and proceedings.  |2 fast  |0 (OCoLC)fst01423772 
700 1 |a Han, Yafang,  |e editor. 
700 1 |a Gu, Zhongwei,  |e editor. 
700 1 |a Fu, Qiang,  |d 1963-  |e editor. 
776 0 8 |i Print version:  |a Chinese Materials Congress (2014 : Chengdu, China).  |t Advanced functional materials : selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China.  |d Pfäffikon, Switzerland : Trans Tech Publications Ltd, ©2015  |h 712 pages  |k Materials science forum ; Volume 815  |x 1662-9752  |z 9783038353942 
830 0 |a Materials science forum ;  |v v. 815. 
856 4 0 |u https://ebsco.uam.elogim.com/login.aspx?direct=true&scope=site&db=nlebk&AN=975672  |z Texto completo 
938 |a Trans Tech Publications, Ltd  |b TRAN  |n 10.4028/www.scientific.net/MSF.815 
938 |a ProQuest Ebook Central  |b EBLB  |n EBL2008335 
938 |a ebrary  |b EBRY  |n ebr11042417 
938 |a YBP Library Services  |b YANK  |n 12375751 
938 |a EBSCOhost  |b EBSC  |n 975672 
994 |a 92  |b IZTAP