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11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /
Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Mat...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor Corporativo: | |
| Otros Autores: | |
| Formato: | Electrónico Congresos, conferencias eBook |
| Idioma: | Inglés |
| Publicado: |
Pfaffikon, Switzerland :
TTP,
2014.
|
| Colección: | Advanced materials research ;
v. 1038. |
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
| LEADER | 00000cam a2200000 i 4500 | ||
|---|---|---|---|
| 001 | EBSCO_ocn893677821 | ||
| 003 | OCoLC | ||
| 005 | 20231017213018.0 | ||
| 006 | m o d | ||
| 007 | cr cn||||||||| | ||
| 008 | 141017t20142014sz a ob 101 0 eng d | ||
| 040 | |a E7B |b eng |e rda |e pn |c E7B |d OCLCO |d N$T |d CUS |d EBLCP |d OCLCF |d YDXCP |d DEBSZ |d OCLCO |d OCLCQ |d OCLCO |d OCL |d OCLCO |d LLB |d OCLCQ |d AGLDB |d UAB |d CCO |d PIFAG |d ZCU |d MERUC |d U3W |d MOZ |d STF |d OCLCQ |d VTS |d ICG |d INT |d VT2 |d OCLCQ |d WYU |d S9I |d TKN |d OCLCO |d OCLCQ |d DKC |d AU@ |d OCLCQ |d M8D |d HS0 |d OCLCQ |d TTECH |d AJS |d OCLCO |d OCLCQ |d QGK | ||
| 019 | |a 959866342 |a 961566728 |a 962661161 |a 1259235860 | ||
| 020 | |a 9783038266365 |q (electronic bk.) | ||
| 020 | |a 3038266361 |q (electronic bk.) | ||
| 020 | |z 9783038352525 | ||
| 029 | 1 | |a DEBBG |b BV043617039 | |
| 029 | 1 | |a DEBBG |b BV043783207 | |
| 029 | 1 | |a DEBSZ |b 43189602X | |
| 029 | 1 | |a DEBSZ |b 472851063 | |
| 035 | |a (OCoLC)893677821 |z (OCoLC)959866342 |z (OCoLC)961566728 |z (OCoLC)962661161 |z (OCoLC)1259235860 | ||
| 050 | 4 | |a TK7882.I6 |b .I584 2014eb | |
| 072 | 7 | |a TEC |x 009070 |2 bisacsh | |
| 082 | 0 | 4 | |a 621.367 |2 23 |
| 049 | |a UAMI | ||
| 111 | 2 | |a International Congress Molded Interconnect Devices |n (11th : |d 2014 : |c Nuremberg, Germany, and Fuerth, Germany) | |
| 245 | 1 | 0 | |a 11th international congress molded interconnect devices : |b scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / |c edited by Jörg Franke [and three others]. |
| 264 | 1 | |a Pfaffikon, Switzerland : |b TTP, |c 2014. | |
| 264 | 2 | |a Enfield, New Hampshire : |b Trans Tech Publications Ltd, |c [date of distribution not identified] | |
| 264 | 4 | |c ©2014 | |
| 300 | |a 1 online resource (119 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 347 | |a data file | ||
| 490 | 1 | |a Advanced Materials Research, |x 1662-8985 ; |v Volume 1038 | |
| 504 | |a Includes bibliographical references at the end of each chapters and index. | ||
| 588 | 0 | |a Online resource; title from PDF title page (ebrary, viewed October 16, 2014). | |
| 520 | |a Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. Keyword: Printing Technologies, Materiala Manufacturing, Manufatruting processes, Inspection, assemply technologies, quality testing The 16 papers collected here are from the 11th International Congress Molded Interconnect Devices (MID 2014), held in September 2014 in Nuremberg/Fuerth, Germany. Technology specialists from Europe, the US, and Taiwan address development and prototyping, printing technologies, materials and manufacturing, manufacturing processes, assembly technologies and inspection, and quality and reliability. -- Electronic components and devices-- Electronic engineering-- Materials science. | ||
| 505 | 0 | |a 11th International Congress Molded Interconnect Devices -- Scientific Proceedings; Preface and Committees; Table of Contents; Chapter 1: Development and Prototyping; Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices; Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools; Optimized Process Sequences for Prototyping of Molded Interconnect Devices; Integration of Functional Circuits into FDM Parts | |
| 505 | 8 | |a Chapter 2: Printing TechnologiesPrinting of Functional Structures on Molded 3D Devices; Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing; Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing; Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing; Chapter 3: Materials and Manufacturing; Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz | |
| 505 | 8 | |a Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray MethodExperimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography; MID Fabricated by Ultrasonic Processing; Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation; Chapter 4: Manufacturing Processes; Study of MID Technologies for Automotive Lighting and Light Signaling Devices; Chapter 5: Assembly Technologies and Inspection | |
| 505 | 8 | |a Design and Solder Process Optimization in MID Technology for High Power ApplicationsChapter 6: Quality and Reliability; Hot Pin Pull Method -- New Test Procedure for the Adhesion Measurement for 3D-MID; Keywords Index; Authors Index | |
| 546 | |a English. | ||
| 590 | |a eBooks on EBSCOhost |b EBSCO eBook Subscription Academic Collection - Worldwide | ||
| 650 | 0 | |a Molded interconnect devices. | |
| 650 | 0 | |a Three-dimensional display systems |v Congresses. | |
| 650 | 6 | |a Affichage tridimensionnel |v Congrès. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Mechanical. |2 bisacsh | |
| 650 | 7 | |a Molded interconnect devices. |2 fast |0 (OCoLC)fst01024697 | |
| 650 | 7 | |a Three-dimensional display systems. |2 fast |0 (OCoLC)fst01150324 | |
| 655 | 7 | |a Conference papers and proceedings. |2 fast |0 (OCoLC)fst01423772 | |
| 700 | 1 | |a Franke, Jörg |c (Prof. Dr.-Ing.), |e editor. | |
| 776 | 0 | 8 | |i Print version: |a International Congress Molded Interconnect Devices (11th : 2014 : Nuremberg / Fuerth, Germany). |t 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. |d Pfaffikon, Switzerland : TTP, ©2014 |h 124 pages |k Advanced materials research ; Volume 1038 |x 1662-8985 |z 9783038352525 |
| 830 | 0 | |a Advanced materials research ; |v v. 1038. | |
| 856 | 4 | 0 | |u https://ebsco.uam.elogim.com/login.aspx?direct=true&scope=site&db=nlebk&AN=862190 |z Texto completo |
| 936 | |a BATCHLOAD | ||
| 938 | |a EBL - Ebook Library |b EBLB |n EBL1910949 | ||
| 938 | |a ebrary |b EBRY |n ebr10951273 | ||
| 938 | |a EBSCOhost |b EBSC |n 862190 | ||
| 938 | |a Trans Tech Publications, Ltd |b TRAN |n 10.4028/www.scientific.net/AMR.1038 | ||
| 938 | |a YBP Library Services |b YANK |n 12107168 | ||
| 994 | |a 92 |b IZTAP | ||