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|a International Symposium for Testing and Failure Analysis
|n (39th :
|d 2013 :
|c San Jose, Calif.)
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| 245 |
1 |
0 |
|a ISTFA 2013 :
|b conference proceedings from the 39th International Symposium for Testing and Failure Analysis, November 3-7, 2013, San Jose Convention Center, San Jose, California, USA /
|c sponsored by Electronic Device Failure Analysis Society.
|
| 264 |
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1 |
|a Materials Park, Ohio :
|b ASM International,
|c 2013.
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| 264 |
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|c ©2013
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| 300 |
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|a 1 online resource (633 pages) :
|b color illustrations, charts, photographs, graphs, tables
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 504 |
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|a Includes bibliographical references at the end of each chapters and index.
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| 588 |
0 |
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|a Online resource; title from PDF title page (ebrary, viewed August 30, 2014).
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|a Title Page -- Copyright -- Board of Directors -- Organizing Committee -- Symposium Committee -- User Groups -- Contents -- 2013 IPFA Best Paper -- Non-Destructive Open Fault Isolation in Flip-Chip Devices with Space-Domain Reflectometry -- 3D Packages -- 3D Void Imaging in Through Silicon Vias by X-ray Nanotomography in a SEM -- Challenges for Physical Failure Analysis of 3D-Integrated Devices -- Sample Preparation and Analysis to Support Process Development of TSVs -- Sample Preparation Strategies for Fast and Effective Failure Analysis of 3D Devices
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| 505 |
8 |
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|a Fast and Precise 3D Tomography of TSV by Using Xe Plasma FIBCase Studies and the Failure Analysis Process -- 22 nm BEOL TDDB Defect Localization and Root Cause Analysis -- Open Failure Diagnosis Candidate Selection Based on Passive Voltage Contrast Potential and Processing Cost -- Effective Defect Localization on Nanoscale Short Failures -- Defect Isolation Tools Accelerate the Failure Analysis Process -- First in Operando SEM Observation of Electromigration-Induced Voids in TSV Structures
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| 505 |
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|a The Application of Magnetic Force Microscopy for Detection of Subsurface Anomalies in Semiconductor Device Wiring LevelsComputed Tomography as Failure Analysis Insurance -- Challenges of Small Defect Analysis in Large Analog Power FET Arrays -- Conversion of a D-Mode FET to an E-Mode FET via Electrostatic Discharge in a GaAs Power Amplifier Duplexer Module -- Marginal RF Gain Investigation and Root Cause Determination -- Anamnesis in Failure Analysis -- How a System-Related Approach Can Save Failure Analysis (FA) Time, Shorten Learning Loops and Reduce Cost
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| 505 |
8 |
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|a Failure Analysis for SRAM Logic Type FailuresCircuit Edit -- Circuit Edit Geometric Trends -- Implications of Helium and Neon Ion Beam Chemistry for Advanced Circuit Editing -- Silicon and Package Preparation Options for Focused Ion Beam (FIB) Circuit Editing and General Packaging Failure Analysis -- Defect Characterization and Metrology -- Simulation Studies on Fluorine Spec Limit for Process Monitoring of Microchip Al Bondpads in Wafer Fabrication -- Surface Microstructure Evolution Upon Silicidation of Ni(Pt) and the Different Responses to Metal Etch
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| 505 |
8 |
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|a Gate Leakage Characterization and Fail Mode Analysis on 20 nm Technology Parametric Test StructuresSTEM EDX Mappings and Tomography for Process Characterization and Physical Failure Analysis of Advanced Devices -- Automatic Registering and Stitching of TEM/STEM Image Mosaics -- AFM-Based Chemical and Mechanical Property Characterization of Interconnects and Defects -- Evaluation of Digital Holography Microscopy for Roughness Control Prior Wafer Direct Bonding -- Emerging Concepts and Techniques -- Pump-Probe Imaging of Integrated Circuits
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| 546 |
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|a English.
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| 590 |
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|a eBooks on EBSCOhost
|b EBSCO eBook Subscription Academic Collection - Worldwide
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| 650 |
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0 |
|a Electronics
|x Materials
|x Testing
|v Congresses.
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| 650 |
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0 |
|a Electronic apparatus and appliances
|x Testing
|v Congresses.
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| 650 |
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6 |
|a Appareils électroniques
|x Essais
|v Congrès.
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| 650 |
|
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| 655 |
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|a Conference papers and proceedings
|2 fast
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| 710 |
2 |
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|a Electronic Device Failure Analysis Society,
|e sponsor.
|
| 776 |
0 |
8 |
|i Print version:
|a International Symposium for Testing and Failure Analysis (39th : 2013 : San Jose, California).
|t ISTFA 2013 : conference proceedings from the 39th International Symposium for Testing and Failure Analysis, November 3-7, 2013, San Jose Convention Center, San Jose, California, USA.
|d Materials Park, Ohio : ASM International, ©2013
|h xix, 613 pages
|z 9781627080224
|
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