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|a 985342241
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|a 1162059644
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|a 9781633211865
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|a UAMI
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| 245 |
0 |
0 |
|a Thin film chemical vapor deposition in electronics :
|b equipment, methodology, and thin film growth experience /
|c editor, Vladislav Yu Vasilyev (Novosibirsk State Technical University, Russian Federation).
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| 264 |
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1 |
|a New York :
|b Nova Publishers,
|c [2014]
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| 300 |
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|a 1 online resource
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 490 |
1 |
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|a Materials science and technologies series
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| 504 |
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|a Includes bibliographical references and index.
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| 588 |
0 |
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|a Print version record.
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0 |
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|a THIN FILM CHEMICAL VAPOR DEPOSITION IN ELECTRONICS: EQUIPMENT, METHODOLOGY AND THIN FILM GROWTH EXPERIENCE; THIN FILM CHEMICAL VAPOR DEPOSITION IN ELECTRONICS: EQUIPMENT, METHODOLOGY AND THIN FILM GROWTH EXPERIENCE; Library of Congress Cataloging-in-Publication Data; CONTENTS; PREFACE; LIST OF ABBREVIATIONS; LIST OF IMPORTANT SYMBOLS; PART 1. CVD EQUIPMENT, PROCESS AND THIN FILM METHODOLOGY; Chapter 1: BASIC THIN FILM MATERIALS IN INTEGRATED CIRCUIT TECHNOLOGY; 1.1. INTRODUCTORY REVIEW; 1.2. BASIC THIN FILM MATERIALS IN INTEGRATED CIRCUITS; 1.3. BRIEF REVIEW OF THE AUTHOR EXPERIENCE.
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| 505 |
8 |
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|a 1.4. THE GOAL OF THE MONOGRAPHREFERENCES; Chapter 2: GENERAL THIN FILM CVD CHARACTERIZATION; 2.1. BASIC DEFINITIONS; 2.2. TYPES OF THIN FILM CVD REACTIONS; 2.3. CHEMICAL COMPOUNDS USED FOR THIN FILM CVD; 2.4. THERMODYNAMIC ASPECTS OF CVD THIN FILM GROWTH; 2.5. THIN FILM CVD GAS DYNAMIC REGIMES; 2.6. GENERAL KINETIC ASPECTS OF CVD THIN FILM GROWTH; 2.7. BASIC CVD THIN FILM GROWTH FUNCTIONAL DEPENDENCES; 2.8. THIN FILM CVD DEVELOPMENT PROBLEMATICS; REFERENCES; Chapter 3: BASIC FLOW CVD REACTOR DESIGNS AND PROCESS METHODOLOGY; 3.1. CVD TOOL STUCTURE; 3.2. CVD REACTOR DESIGN.
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|a 3.3. BASIC THIN FILM CVD PROCESS PARAMETERS3.4. BASIC THIN FILM CVD PROCESS METHODOLOGY; REFERENCES; Chapter 4: PULSED CVD TOOLS AND PROCESS METHODOLOGY; 4.1. INTRODUCTORY REMARKS; 4.2. PULSED CVD TOOL DESING; 4.3. PULSED CVD TOOL VACUUM SYSTEM CHARACTERISTICS; 4.4. PULSED CVD TOOL GAS SYSTEM CHARACTERISTICS; 4.5. ROLE OF MFC IN PULSED CVD PROCESSES; 4.5. CONSECUTIVE PULSED CVD PROCESS METHODOLOGY; 4.6. WAFER TEMPERATURE; CONCLUSION; REFERENCES; Chapter 5: BRIEF REVIEW ON CVD THIN FILM ANALYSIS TECHNIQUES; 5.1. INTRODUCTORY REVIEW; 5.2. FILM THICKNESS; 5.3. FILM COMPOSITION.
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| 505 |
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|a 5.4. FILM PROPERTIES5.5. FILM ELECTRICAL PROPERTIES; REFERENCES; Chapter 6: METHODOLOGY OF THIN FILM CVD KINETIC STUDIES; 6.1. GENERAL CONSIDERATIONS; 6.2. PRACTICAL IMPLEMENTATION OF THIN FILM CVD KINETIC METHODOLOGY FOR CVD PROCESSES ANALYSIS; 6.3. RESEARCH METHODOLOGY FOR LPCVD PRODUCTUION PROCESSES; 6.4. EXPERIMENTAL METHODOLOGY FOR SINGLE VAFER CHAMBER CVD PROCESSES; REFERENCES; PART 2. EXAMPLES OF THIN FILM GROWTH KINETICS STUDIES; Chapter 7: SEMICONDUCTOR THIN FILM CVD: POLYSILICON; 7.1. INTRODUCTORY REMARKS; 7.2. BASIC DATA ON MONOSILANE PYROLISYS KINETICS.
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| 505 |
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|a 7.3. POLYSILICON GRAIN SIZE FEATURES7.4. THIN POLYCRYSTALLINE FILMS GROWTH IN PRODUCTION BATCH LPCVD REACTORS; 7.5. BRIEF VIEW ON THE POLYCRYSTALLINE FILMS GROWTH SCHEMES AND MECHANISMS; 7.6. PLASMA-ENHANCED POLYSILICON DEPOSITION; REFERENCES; Chapter 8: DIELECTRIC THIN FILM CVD: SILICON NITRIDE; 8.1. INTRODUCTORY REMARKS; 8.2. MONOSILANE-AMMONIA SYSTEM; 8.3. SILICON TETRACHLORIDE-AMMONIA SYSTEM; 8.4. DICHLOROSILANE-AMMONIA SYSTEM; 8.5. BRIEF VIEW ON THE SILICON NITRIDE THIN FILM GROWTH SCHEMES AND MECHANISMS; 8.6. PRODUCTION PROCESSES OF SILICON NITRIDE THIN FILM DEPOSITION; REFERENCES.
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| 546 |
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|a English.
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| 590 |
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|a eBooks on EBSCOhost
|b EBSCO eBook Subscription Academic Collection - Worldwide
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| 650 |
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0 |
|a Thin film devices.
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| 650 |
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0 |
|a Integrated circuits
|x Design and construction.
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| 650 |
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|a Chemical vapor deposition.
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| 650 |
|
6 |
|a Dispositifs à couches minces.
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| 650 |
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|a Circuits intégrés
|x Conception et construction.
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| 650 |
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6 |
|a Dépôt chimique en phase vapeur.
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| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Mechanical.
|2 bisacsh
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| 650 |
|
7 |
|a Chemical vapor deposition.
|2 fast
|0 (OCoLC)fst00853229
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| 650 |
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7 |
|a Integrated circuits
|x Design and construction.
|2 fast
|0 (OCoLC)fst00975545
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| 650 |
|
7 |
|a Thin film devices.
|2 fast
|0 (OCoLC)fst01150011
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| 700 |
1 |
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|a Vasilʹev, V. I͡U.
|q (Vladislav I͡Urʹevich),
|e author.
|
| 776 |
0 |
8 |
|i Print version:
|t Thin film chemical vapor deposition in electronics
|z 9781633211506
|w (DLC) 2014019878
|w (OCoLC)879603973
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| 830 |
|
0 |
|a Materials science and technologies series.
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