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Nanolithography : the art of fabricating nanoelectronic and nanophotonic devices and systems /
Integrated circuits, and devices fabricated using the techniques developed for integrated circuits, have steadily gotten smaller, more complex, and more powerful. The rate of shrinking is astonishing - some components are now just a few dozen atoms wide. This book attempts to answer the questions, &...
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Philadelphia, PA :
Woodhead Pub.,
2014.
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| Colección: | Woodhead Publishing series in electronic and optical materials ;
no. 42. |
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Cover ; Nanolithography: The art of fabricating nanoelectronic and nanophotonic devices and systems ; Copyright ; Contents; Contributor contact details; Woodhead Publishing Series in Electronic and Optical Materials; Preface; 1: Optical projection lithography; 1.1 Introduction; 1.2 Lithography technology and trends; 1.3 Fundamentals of optical lithography; 1.4 Image evaluation; 1.5 Projection lithography systems; 1.6 Wavelengths for optical lithography; 1.7 Lithography in the deep ultraviolet (UV); 1.8 Resolution enhancement technology; 1.9 Immersion lithography.
- 1.10 Multiple patterning optical lithography1.11 Conclusion; 1.12 References; 2: Extreme ultraviolet (EUV) lithography; 2.1 Introduction; 2.2 EUV sources; 2.3 EUV optics; 2.4 EUV masks; 2.5 EUV resists; 2.6 EUV integration and implementation challenges; 2.7 Conclusion and future trends; 2.8 Acknowledgments; 2.9 References; 3: Electron beam lithography; 3.1 Introduction; 3.2 Using pixel parallelism to address the throughput bottleneck; 3.3 The tradeoff between resolution and throughput; 3.4 Distributed systems; 3.5 Ultimate lithographic resolution.
- 3.6 Electron-beam patterning of photomasks for optical lithography3.7 Conclusion; 3.8 Acknowledgements; 3.9 References; 4: Focused ion beams for nano-machining and imaging; 4.1 Introduction; 4.2 An adumbrated history of focused ion beams (FIBs); 4.3 Sources of ions: a quartet of types; 4.4 Charged particle optics; 4.5 Ion-matter interactions; 4.6 Milling; 4.7 Deposition; 4.8 Imaging; 4.9 Spectroscopy; 4.10 Conclusion and future trends; 4.11 References; 5: Masks for microand nanolithography; 5.1 Introduction; 5.2 Mask materials; 5.3 Mask process; 5.4 Mask metrology; 5.5 Defects and masks.
- 5.6 Conclusion5.7 References; 6: Maskless photolithography; 6.1 Introduction; 6.2 The use of photons as opposed to charged particles; 6.3 Forms of maskless photolithography; 6.4 Zone-plate-array lithography (ZPAL); 6.5 Proximity-effect correction; 6.6 Extending the resolution of ZPAL; 6.7 Commercialization of ZPAL by LumArray, Inc.; 6.8 Conclusion; 6.9 References; 7: Chemistry and processing of resists for nanolithography; 7.1 Introduction; 7.2 Resists for optical lithography: synthesis and radiation induced chemistry of resists as a function of exposure technology.
- 7.3 Chemically amplified resist process considerations7.4 Chemically amplified resists for 193 nm lithography; 7.5 Resists for extreme ultraviolet lithography (EUVL); 7.6 Resists for electron beam lithography; 7.7 Resists for selected forward looking lithographic technologies; 7.8 Resist resolution limitations; 7.9 Conclusion; 7.10 References; 8: Directed assembly nanolithography; 8.1 Introduction; 8.2 Block copolymers in lithography; 8.3 Directed self-assembly of block copolymers; 8.4 Programmable three-dimensional lithography; 8.5 Conclusion; 8.6 References; 9: Nanoimprint lithography.