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Design and modeling for 3D ICs and interposers /
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the silicon via (TSV) and glass via (TGV) technology,...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Hackensack, NJ :
World Scientific,
2014.
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| Colección: | WSPC series in advanced integration and packaging ;
2. |
| Temas: | |
| Acceso en línea: | Texto completo |