ISTFA 2008 : conference proceedings of the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA /

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores Corporativos: International Symposium for Testing and Failure Analysis Portland, Or., ASM International, Electronic Device Failure Analysis Society
Formato: Electrónico Congresos, conferencias eBook
Idioma:Inglés
Publicado: Materials Park, Ohio : ASM International, 2008.
Temas:
Electronics > Materials > Testing > Congresses.
Electronic apparatus and appliances > Testing > Congresses.
Appareils électroniques > Essais > Congrès.
TECHNOLOGY & ENGINEERING > Electronics > Digital.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
Electronic apparatus and appliances > Testing
Electronics > Materials > Testing
Conference papers and proceedings
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Contents
  • IPFA 07 Best Paper
  • Session 1: Emerging Concepts
  • Session 2: Packaging and Assembly Level FA I
  • Session 3: Failure Analysis Process I
  • Session 4: Package and Assembly Level FA II
  • Session 5: Circuit-Edit
  • Session 6: Sample Preparation I
  • Session 7: Photon Based Techniques I
  • Session 8: Scanned Probe Microscopy
  • Session 9: Photon Based Techniques II
  • Session 10: Posters
  • Session 11: System Level Failure Analysis
  • Session 12: Sample Preparation II
  • Session 13: Test
  • Session 14: Photon Based Techniques III
  • Session 15: NanoprobingSession 16: Yield Enhancement
  • Session 17: Failure Analysis Process II
  • Session 18: Metrology
  • Author Index

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