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EBSCO_ocn854633376 |
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130730s2008 ohua ob 101 0 eng d |
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|a 923570163
|a 929147628
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|a 9781615030910
|q (electronic bk.)
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|a 1615030913
|q (electronic bk.)
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|z 9780871707147
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|a (OCoLC)854633376
|z (OCoLC)923570163
|z (OCoLC)929147628
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4 |
|a TK7871
|b .I58 2008eb
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|a TEC
|x 008060
|2 bisacsh
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|a 621.381
|2 23
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| 049 |
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|a UAMI
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| 111 |
2 |
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|a International Symposium for Testing and Failure Analysis
|n (34th :
|d 2008 :
|c Portland, Or.)
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| 245 |
1 |
0 |
|a ISTFA 2008 :
|b conference proceedings of the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA /
|c sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2008, ASM International.
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| 246 |
3 |
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|a International Symposium for Testing and Failure Analysis 2008
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| 246 |
3 |
0 |
|a Proceedings of the 34th International Symposium for Testing and Failure Analysis
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| 246 |
3 |
0 |
|a 34th International Symposium for Testing and Failure Analysis
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| 246 |
3 |
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|a Thirty-fourth International Symposium for Testing and Failure Analysis
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| 260 |
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|a Materials Park, Ohio :
|b ASM International,
|c 2008.
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| 300 |
|
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|a 1 online resource (xx, 528 pages) :
|b illustrations
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 500 |
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|a Some online versions lack accompanying media packaged with the printed version.
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| 504 |
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|a Includes bibliographical references and index.
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| 588 |
0 |
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|a Print version record.
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| 505 |
0 |
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|a Contents -- IPFA 07 Best Paper -- Session 1: Emerging Concepts -- Session 2: Packaging and Assembly Level FA I -- Session 3: Failure Analysis Process I -- Session 4: Package and Assembly Level FA II -- Session 5: Circuit-Edit -- Session 6: Sample Preparation I -- Session 7: Photon Based Techniques I -- Session 8: Scanned Probe Microscopy -- Session 9: Photon Based Techniques II -- Session 10: Posters -- Session 11: System Level Failure Analysis -- Session 12: Sample Preparation II -- Session 13: Test -- Session 14: Photon Based Techniques III
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| 505 |
8 |
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|a Session 15: NanoprobingSession 16: Yield Enhancement -- Session 17: Failure Analysis Process II -- Session 18: Metrology -- Author Index
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| 590 |
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|a eBooks on EBSCOhost
|b EBSCO eBook Subscription Academic Collection - Worldwide
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| 650 |
|
0 |
|a Electronics
|x Materials
|x Testing
|v Congresses.
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| 650 |
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0 |
|a Electronic apparatus and appliances
|x Testing
|v Congresses.
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| 650 |
|
6 |
|a Appareils électroniques
|x Essais
|v Congrès.
|
| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Digital.
|2 bisacsh
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| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Microelectronics.
|2 bisacsh
|
| 650 |
|
7 |
|a Electronic apparatus and appliances
|x Testing
|2 fast
|
| 650 |
|
7 |
|a Electronics
|x Materials
|x Testing
|2 fast
|
| 655 |
|
7 |
|a Conference papers and proceedings
|2 fast
|
| 710 |
2 |
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|a ASM International.
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| 710 |
2 |
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|a Electronic Device Failure Analysis Society.
|
| 776 |
0 |
8 |
|i Print version:
|a International Symposium for Testing and Failure Analysis (34th : 2008 : Portland, Oregon.).
|t ISTFA 2008.
|d Materials Park, Ohio : ASM International, 2008
|z 9781615030910
|w (OCoLC)317955622
|
| 856 |
4 |
0 |
|u https://ebsco.uam.elogim.com/login.aspx?direct=true&scope=site&db=nlebk&AN=395835
|z Texto completo
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|a EBSCOhost
|b EBSC
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| 938 |
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|a YBP Library Services
|b YANK
|n 3623547
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|a 92
|b IZTAP
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