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Functional and electronic materials : selected, peer reviewed papers from IUMRS-ICA 2010, 11th IUMRS International Conference in Asia, 25-28 September 2010, Qingdao, China /

These 146 peer-reviewed papers cover the current understanding of researchers working in the fields of electronic materials and devices, ferroelectric, piezoelectric and dielectric materials, smart materials, the science and advanced technology of gels and aggregates, and thin-film materials and tec...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: IUMRS International Conference in Asia
Otros Autores: Li, Chengming
Formato: Electrónico Congresos, conferencias eBook
Idioma:Inglés
Publicado: Durnten-Zurich, Switzerland : Trans Tech Publications, ©2011.
Colección:Materials science forum ; v. 687.
Temas:
Acceso en línea:Texto completo

MARC

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245 0 0 |a Functional and electronic materials :  |b selected, peer reviewed papers from IUMRS-ICA 2010, 11th IUMRS International Conference in Asia, 25-28 September 2010, Qingdao, China /  |c edited by Chengming Li [and others]. 
260 |a Durnten-Zurich, Switzerland :  |b Trans Tech Publications,  |c ©2011. 
300 |a 1 online resource (xiv, 814 pages) :  |b illustrations 
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490 1 |a Materials science forum,  |x 0255-5476 ;  |v v. 687 
504 |a Includes bibliographical references and indexes. 
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520 |a These 146 peer-reviewed papers cover the current understanding of researchers working in the fields of electronic materials and devices, ferroelectric, piezoelectric and dielectric materials, smart materials, the science and advanced technology of gels and aggregates, and thin-film materials and technology. A useful source of the latest information. Review from Book News Inc.: Volume three of the five volumes from the September 2010 conference contains 146 papers presented during five symposia on materials for electronic devices, smart materials, gels and aggregates, thin films, and ferroelect. 
505 8 |a Effect of Pr on the Microstructure and Electrical Properties of Ta-Doped TiO2 Capacitor-Varistor CeramicsEffect of RE on Creep Rupture Life of SnAgCu Solder Joints; Effect of Trace Cerium on the As-Cast Microstructure of Ag-Cu-Ni Alloy; Effects of Sintering Temperature on the Barium Hexaferrite Thick Films Prepared by Screen Printing Method; Effects of SnO2 Doping on the Performance of ZnO Porous Thick Film Gas Sensors; Effects of the CNT on the Preparation and Electrochemical Performances of the CNT / PANI Hollow Sphere Composite 
505 8 |a Efficient Guiding of Terahertz Wave by Thin Metal Corrugation on Both SurfacesElectrical and Optical Properties of ZnO-Doped Zr0.8Sn0.2TiO4 Thin Films on ITO/Glass Substrates by RF Magnetron Sputtering; Fabrication and Thermoelectricity of (Ca1-XAX)3Co4O9 Composition-Spread Films; Formation and Evolution of Intermetallic Compounds in Solder Joint for Electronic Interconnect; Growing Behaviors of Oxidation Film on the Surface of Liquid Sn-0.68Cu-0.3Ag-X Solder; Growth of Wafer Size Graphene on SiC Substrates 
505 8 |a Influence of Magnetic Field Thermal Annealing on the High- Frequency Performance of the FeCo-Based Granular Thin FilmsInfluence of SiO2 Layer on Resistive Switching Properties of SiO2/CuXO Stack Structure; Interfacial Microstructures and Kinetics of Sn2.5Ag0.7Cu/Cu; Magnetic and Magneto-Optical Properties of Sputtered Co-CeO2 Thin Films on Al2O3 (0001) Substrates with (100) Orientation ; Magnetic and Mechanical Properties of Directionally Solidified Fe-6.5wt.%Si Alloy; Magnetic Properties of Highly Permeable MnZn Ferrites with Addition of Phosphorous Pentoxide 
546 |a English. 
590 |a eBooks on EBSCOhost  |b EBSCO eBook Subscription Academic Collection - Worldwide 
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650 7 |a Materials.  |2 fast  |0 (OCoLC)fst01011772 
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