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Encyclopedia of thermal packaging. Set 1, Thermal packaging techniques /
Please click here for information on Set 2: Thermal Packaging ToolsThermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electro...
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Singapore :
World Scientific,
©2013.
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| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Vol. 1. Microchannel heat sinks for electronics cooling / Suresh V. Garimella, Tannaz Harirchian
- v. 2. Air- and liquid-cooled cold plates / Allan Kraus
- v. 3. Dielectric liquid cooling of immersed components / Karl J.L. Geisler. Avram Bar-Cohen
- v. 4. Thermoelectric microcoolers / Bao Yang, Peng Wang
- v. 5. Energy efficienct solid state lighting / Mehmet Arik, Anant Setlur, Stanton E. Weaver Jr., Joseph J. Shiang
- v. 6. Experimental thermofluid characterization of electronic components / Gary L. Solbrekken.
- Foreword to the Encyclopedia of Thermal Packaging by Wataru Nakayama; Preface; Contents; Chapter 1 Introduction; 1.1. Physics and Applications of Microchannels; 1.2. Use of Microchannels in Electronics Cooling; References; Chapter 2 Design and Optimization of Single-Phase Microchannel Heat Sinks; 2.1. Prediction of Heat Transfer Coefficient; 2.1.1. Experiments and comparison to correlations; 2.1.2. Numerical analyses; 2.1.3. Correlations; 2.2. Prediction of Pressure Drop; 2.3. Optimization of Heat Transfer Performance; 2.4. Importance of Inlet Manifold Design; 2.5. Hot-Spot Thermal Management.
- 2.6. System-Level Design and OptimizationReferences; Chapter 3 Two-Phase Operation of Microchannel Heat Sinks; 3.1. Fundamentals of Two-Phase Transport in Microchannels; 3.2. Macroscale versus Microscale Boiling; 3.3. Flow Regime Maps; References; Chapter 4 Boiling Heat Transfer at Small Scales; 4.1. Saturated Boiling in Microchannels; 4.2. Heat Transfer in Boiling and Two-Phase Flow; 4.3. Effect of Geometrical and Flow Parameters; 4.3.1. Effect of channel dimensions; 4.3.2. Effect of mass flow rate; 4.3.3. Effect of surface roughness; 4.4. Empirical Predictions of Thermal Performance.
- 4.4.1. Subcooled boiling regime4.4.2. Saturated boiling regime; 4.4.3. Saturated flow boiling correlation; 4.5. Physics-Based Modeling of Boiling Heat Transfer; 4.5.1. Annular flow; 4.5.1.1. Solution procedure; 4.5.1.2. Model assessment; 4.5.2. Annular/Wispy-annular flow; 4.5.3. Slug flow; References; Chapter 5 Pressure Drop in Two-Phase Flow; 5.1. Two-Phase Flow Pressure Drop; 5.2. Empirical Prediction of Two-Phase Pressure Drop; 5.3. Regime-Based Modeling of Two-Phase Pressure Drop; 5.3.1. Confined flow; 5.3.2. Unconfined flow; 5.3.3. Model assessment; References.
- Chapter 6 Micropumps and Pumping Requirements6.1. Microscale Pumping Technologies; 6.2. Mechanical Displacement Micropumping Techniques; 6.2.1. Diaphragm displacement pumps; 6.2.2. Fluid displacement pumps; 6.2.3. Rotary pumps; 6.3. Electro- and Magneto-Kinetic Micropumping Techniques; 6.3.1. Electrohydrodynamic pumps; 6.3.1.1. Induction-type EHD; 6.3.1.2. Injection-type EHD; 6.3.1.3. Polarization-type EHD; 6.3.1.4. Ion-drag; 6.3.2. Electroosmotic pumps; 6.3.2.1. DC electroosmotic; 6.3.2.2. AC electroosmotic; 6.3.3. Magnetohydrodynamic pumps; 6.3.4. Electrowetting pumps; 6.3.5. Other.
- 6.4. Pump Selection6.4.1. Materials and construction; 6.4.2. Selection guidelines; References; Chapter 7 Challenges in Implementation; 7.1. Effect of Dissolved Air on System Performance; 7.1.1. Degassing scheme; 7.2. System Instabilities for Boiling in Microchannels; 7.3. Critical Heat Flux; References; Chapter 8 Measurement Techniques; 8.1. Conventional Techniques; 8.2. Microscale Temperature Measurement; 8.3. Optical Flow Measurements; 8.4. Micro-PIV and IR Micro-PIV; 8.5. Laser-Induced Fluorescence Thermometry; References; Author Index; Subject Index; About the Authors.