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Encyclopedia of thermal packaging. Set 1, Thermal packaging techniques /

Please click here for information on Set 2: Thermal Packaging ToolsThermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electro...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Bar-Cohen, Avram, 1946-
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Singapore : World Scientific, ©2013.
Temas:
Acceso en línea:Texto completo

MARC

LEADER 00000cam a2200000Ia 4500
001 EBSCO_ocn824516333
003 OCoLC
005 20231017213018.0
006 m o d
007 cr |n|||||||||
008 130117s2013 si a ob 001 0 eng d
040 |a HKP  |b eng  |e pn  |c HKP  |d OCLCO  |d N$T  |d CDX  |d IDEBK  |d OCLCF  |d VLB  |d EBLCP  |d YDXCP  |d DEBSZ  |d OCLCQ  |d AGLDB  |d OCLCQ  |d VTS  |d STF  |d M8D  |d UKAHL  |d OCLCQ  |d TFW  |d OCLCO  |d OCLCQ  |d OCLCO 
019 |a 825745388  |a 827210188 
020 |a 9789814313797  |q (electronic bk.) 
020 |a 9814313793  |q (electronic bk.) 
020 |a 9781283971713  |q (MyiLibrary) 
020 |a 1283971712  |q (MyiLibrary) 
020 |z 9814313785  |q (6 v. set ;  |q print) 
020 |z 9789814313780  |q (6 v. set ;  |q print) 
029 1 |a AU@  |b 000058362097 
029 1 |a DEBBG  |b BV043122669 
029 1 |a DEBSZ  |b 381318893 
029 1 |a DEBSZ  |b 421281588 
029 1 |a DEBSZ  |b 454998023 
029 1 |a GBVCP  |b 804232202 
035 |a (OCoLC)824516333  |z (OCoLC)825745388  |z (OCoLC)827210188 
037 |a 428421  |b MIL 
050 4 |a TK7870.15  |b .E49 2013eb 
072 7 |a TEC  |x 008060  |2 bisacsh 
072 7 |a TEC  |x 008070  |2 bisacsh 
082 0 4 |a 621.381046  |2 23 
049 |a UAMI 
245 0 0 |a Encyclopedia of thermal packaging.  |n Set 1,  |p Thermal packaging techniques /  |c edited-in-chief, Avram Bar-Cohen. 
260 |a Singapore :  |b World Scientific,  |c ©2013. 
300 |a 1 online resource 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
504 |a Includes bibliographical references and indexes. 
505 0 0 |g Vol. 1.  |t Microchannel heat sinks for electronics cooling /  |r Suresh V. Garimella, Tannaz Harirchian --  |g v. 2.  |t Air- and liquid-cooled cold plates /  |r Allan Kraus --  |g v. 3.  |t Dielectric liquid cooling of immersed components /  |r Karl J.L. Geisler. Avram Bar-Cohen --  |g v. 4.  |t Thermoelectric microcoolers /  |r Bao Yang, Peng Wang --  |g v. 5.  |t Energy efficienct solid state lighting /  |r Mehmet Arik, Anant Setlur, Stanton E. Weaver Jr., Joseph J. Shiang --  |g v. 6.  |t Experimental thermofluid characterization of electronic components /  |r Gary L. Solbrekken. 
505 0 |a Foreword to the Encyclopedia of Thermal Packaging by Wataru Nakayama; Preface; Contents; Chapter 1 Introduction; 1.1. Physics and Applications of Microchannels; 1.2. Use of Microchannels in Electronics Cooling; References; Chapter 2 Design and Optimization of Single-Phase Microchannel Heat Sinks; 2.1. Prediction of Heat Transfer Coefficient; 2.1.1. Experiments and comparison to correlations; 2.1.2. Numerical analyses; 2.1.3. Correlations; 2.2. Prediction of Pressure Drop; 2.3. Optimization of Heat Transfer Performance; 2.4. Importance of Inlet Manifold Design; 2.5. Hot-Spot Thermal Management. 
505 8 |a 2.6. System-Level Design and OptimizationReferences; Chapter 3 Two-Phase Operation of Microchannel Heat Sinks; 3.1. Fundamentals of Two-Phase Transport in Microchannels; 3.2. Macroscale versus Microscale Boiling; 3.3. Flow Regime Maps; References; Chapter 4 Boiling Heat Transfer at Small Scales; 4.1. Saturated Boiling in Microchannels; 4.2. Heat Transfer in Boiling and Two-Phase Flow; 4.3. Effect of Geometrical and Flow Parameters; 4.3.1. Effect of channel dimensions; 4.3.2. Effect of mass flow rate; 4.3.3. Effect of surface roughness; 4.4. Empirical Predictions of Thermal Performance. 
505 8 |a 4.4.1. Subcooled boiling regime4.4.2. Saturated boiling regime; 4.4.3. Saturated flow boiling correlation; 4.5. Physics-Based Modeling of Boiling Heat Transfer; 4.5.1. Annular flow; 4.5.1.1. Solution procedure; 4.5.1.2. Model assessment; 4.5.2. Annular/Wispy-annular flow; 4.5.3. Slug flow; References; Chapter 5 Pressure Drop in Two-Phase Flow; 5.1. Two-Phase Flow Pressure Drop; 5.2. Empirical Prediction of Two-Phase Pressure Drop; 5.3. Regime-Based Modeling of Two-Phase Pressure Drop; 5.3.1. Confined flow; 5.3.2. Unconfined flow; 5.3.3. Model assessment; References. 
505 8 |a Chapter 6 Micropumps and Pumping Requirements6.1. Microscale Pumping Technologies; 6.2. Mechanical Displacement Micropumping Techniques; 6.2.1. Diaphragm displacement pumps; 6.2.2. Fluid displacement pumps; 6.2.3. Rotary pumps; 6.3. Electro- and Magneto-Kinetic Micropumping Techniques; 6.3.1. Electrohydrodynamic pumps; 6.3.1.1. Induction-type EHD; 6.3.1.2. Injection-type EHD; 6.3.1.3. Polarization-type EHD; 6.3.1.4. Ion-drag; 6.3.2. Electroosmotic pumps; 6.3.2.1. DC electroosmotic; 6.3.2.2. AC electroosmotic; 6.3.3. Magnetohydrodynamic pumps; 6.3.4. Electrowetting pumps; 6.3.5. Other. 
505 8 |a 6.4. Pump Selection6.4.1. Materials and construction; 6.4.2. Selection guidelines; References; Chapter 7 Challenges in Implementation; 7.1. Effect of Dissolved Air on System Performance; 7.1.1. Degassing scheme; 7.2. System Instabilities for Boiling in Microchannels; 7.3. Critical Heat Flux; References; Chapter 8 Measurement Techniques; 8.1. Conventional Techniques; 8.2. Microscale Temperature Measurement; 8.3. Optical Flow Measurements; 8.4. Micro-PIV and IR Micro-PIV; 8.5. Laser-Induced Fluorescence Thermometry; References; Author Index; Subject Index; About the Authors. 
520 |a Please click here for information on Set 2: Thermal Packaging ToolsThermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic prod. 
590 |a eBooks on EBSCOhost  |b EBSCO eBook Subscription Academic Collection - Worldwide 
650 0 |a Electronic packaging. 
650 0 |a Insulation (Heat) 
650 6 |a Mise sous boîtier (Électronique) 
650 7 |a TECHNOLOGY & ENGINEERING  |x Electronics  |x Digital.  |2 bisacsh 
650 7 |a TECHNOLOGY & ENGINEERING  |x Electronics  |x Microelectronics.  |2 bisacsh 
650 7 |a Electronic packaging  |2 fast 
650 7 |a Insulation (Heat)  |2 fast 
700 1 |a Bar-Cohen, Avram,  |d 1946- 
776 0 8 |i Print version:  |t Encyclopedia of thermal packaging. Set 1, Thermal packaging techniques.  |d Singapore : World Scientific, ©2013  |z 9789814313780 
856 4 0 |u https://ebsco.uam.elogim.com/login.aspx?direct=true&scope=site&db=nlebk&AN=525627  |z Texto completo 
938 |a Askews and Holts Library Services  |b ASKH  |n AH24978414 
938 |a Coutts Information Services  |b COUT  |n 24587586 
938 |a ProQuest Ebook Central  |b EBLB  |n EBL1113167 
938 |a EBSCOhost  |b EBSC  |n 525627 
938 |a ProQuest MyiLibrary Digital eBook Collection  |b IDEB  |n cis24587586 
938 |a YBP Library Services  |b YANK  |n 9979932 
994 |a 92  |b IZTAP